XC6SLX150T-2FGG900I
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 540 4939776 147443 900-BBGA |
|---|---|
| Quantity | 616 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 540 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11519 | Number of Logic Elements/Cells | 147443 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX150T-2FGG900I – Spartan®-6 LXT FPGA, 900-BBGA, Industrial
The XC6SLX150T-2FGG900I is a Spartan®-6 LXT field programmable gate array (FPGA) in a 900-ball BGA package, offered in an industrial grade configuration. It delivers a combination of high logic density, sizable on-chip memory and a large I/O count for designs that require substantial integration within a compact, surface-mount footprint.
Key Features
- Logic Capacity — 147,443 logic cells and 11,519 logic elements provide substantial programmable logic resources for complex digital designs.
- Embedded Memory — Approximately 4.94 Mbits of on-chip RAM (4,939,776 bits) to support buffering, FIFOs and local data storage without immediate need for external memory.
- I/O Count — 540 user I/O pins to support wide parallel buses, multiple interfaces and dense connectivity.
- Power Supply — Core supply range of 1.14 V to 1.26 V for consistent operation within a tightly defined voltage window.
- Package & Mounting — 900-ball BGA (supplier device package 900-FBGA, 31 × 31 mm), surface-mount design for high-density PCB integration.
- Temperature & Grade — Industrial grade device rated for operation from −40 °C to 100 °C, supporting deployment in demanding thermal environments.
- Compliance — RoHS compliant.
Unique Advantages
- High logic density: Large pool of logic cells and elements enables consolidation of multiple functions into a single FPGA, reducing component count.
- Substantial on-chip memory: Nearly 5 Mbits of embedded RAM reduces dependence on external memory for buffering and local data processing.
- Extensive I/O capability: 540 I/O pins simplify interfacing to sensors, peripherals and high-pin-count buses without extensive external multiplexing.
- Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging applications.
- Compact BGA packaging: 900-ball BGA (31 × 31 mm) supports dense PCB designs while keeping signal routing manageable.
- Defined core supply window: 1.14 V to 1.26 V specification supports integration with regulated power architectures.
Why Choose XC6SLX150T-2FGG900I?
The XC6SLX150T-2FGG900I delivers a balance of programmable logic capacity, embedded memory and a high I/O count in an industrial temperature-rated BGA package. Its specifications make it well-suited to designs that need significant on-chip resources and dense external connectivity while maintaining a compact board footprint.
As part of the Spartan®-6 LXT family, this FPGA is positioned for engineering teams and procurement professionals seeking a quantifiable set of resources—logic cells, embedded RAM, I/O and defined operating conditions—that align with mid-to-high complexity digital designs deployed in challenging environments.
Request a quote or submit an inquiry to check availability and pricing for XC6SLX150T-2FGG900I.

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