XC6SLX150T-2FGG900I

IC FPGA 540 I/O 900FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 540 4939776 147443 900-BBGA

Quantity 616 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package900-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case900-BBGANumber of I/O540Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11519Number of Logic Elements/Cells147443
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX150T-2FGG900I – Spartan®-6 LXT FPGA, 900-BBGA, Industrial

The XC6SLX150T-2FGG900I is a Spartan®-6 LXT field programmable gate array (FPGA) in a 900-ball BGA package, offered in an industrial grade configuration. It delivers a combination of high logic density, sizable on-chip memory and a large I/O count for designs that require substantial integration within a compact, surface-mount footprint.

Key Features

  • Logic Capacity — 147,443 logic cells and 11,519 logic elements provide substantial programmable logic resources for complex digital designs.
  • Embedded Memory — Approximately 4.94 Mbits of on-chip RAM (4,939,776 bits) to support buffering, FIFOs and local data storage without immediate need for external memory.
  • I/O Count — 540 user I/O pins to support wide parallel buses, multiple interfaces and dense connectivity.
  • Power Supply — Core supply range of 1.14 V to 1.26 V for consistent operation within a tightly defined voltage window.
  • Package & Mounting — 900-ball BGA (supplier device package 900-FBGA, 31 × 31 mm), surface-mount design for high-density PCB integration.
  • Temperature & Grade — Industrial grade device rated for operation from −40 °C to 100 °C, supporting deployment in demanding thermal environments.
  • Compliance — RoHS compliant.

Unique Advantages

  • High logic density: Large pool of logic cells and elements enables consolidation of multiple functions into a single FPGA, reducing component count.
  • Substantial on-chip memory: Nearly 5 Mbits of embedded RAM reduces dependence on external memory for buffering and local data processing.
  • Extensive I/O capability: 540 I/O pins simplify interfacing to sensors, peripherals and high-pin-count buses without extensive external multiplexing.
  • Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging applications.
  • Compact BGA packaging: 900-ball BGA (31 × 31 mm) supports dense PCB designs while keeping signal routing manageable.
  • Defined core supply window: 1.14 V to 1.26 V specification supports integration with regulated power architectures.

Why Choose XC6SLX150T-2FGG900I?

The XC6SLX150T-2FGG900I delivers a balance of programmable logic capacity, embedded memory and a high I/O count in an industrial temperature-rated BGA package. Its specifications make it well-suited to designs that need significant on-chip resources and dense external connectivity while maintaining a compact board footprint.

As part of the Spartan®-6 LXT family, this FPGA is positioned for engineering teams and procurement professionals seeking a quantifiable set of resources—logic cells, embedded RAM, I/O and defined operating conditions—that align with mid-to-high complexity digital designs deployed in challenging environments.

Request a quote or submit an inquiry to check availability and pricing for XC6SLX150T-2FGG900I.

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