XC6SLX150T-3CSG484C

The XC6SLX150T-3CSG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC offered in a 484‑FBGA / 484‑CSPBGA (19×19) package. It provides a high count of programmable logic resources and on-chip memory for compact, board‑level implementations.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory and 296 I/O pins, this commercial‑grade, surface‑mount FPGA targets designs that require substantial logic and memory integration within a compact package while operating from a low-voltage core supply of 1.14 V to 1.26 V.

Key Features

• Logic Capacity — 147,443 logic elements provide extensive programmable logic resources for complex designs.
• Embedded Memory — Approximately 4.94 Mbits of on‑chip RAM to support buffering, state storage, and other memory‑intensive functions.
• I/O Count — 296 user I/O pins to support multiple interfaces and parallel signal routing.
• Package — 484‑FBGA / 484‑CSPBGA (19×19) supplier package suited for high I/O density in a surface‑mount footprint.
• Power — Core voltage supply range 1.14 V to 1.26 V for low‑voltage FPGA core operation.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance — RoHS compliant.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of large, integrated digital functions without external ASICs or discrete logic.
• Substantial on‑chip memory: Approximately 4.94 Mbits of embedded RAM reduce reliance on external memory for many buffering and stateful tasks.
• Extensive I/O resources: 296 I/O pins provide flexibility for multiple interfaces, sensor arrays, and parallel data paths.
• Compact, high‑density package: 484‑CSPBGA (19×19) packaging balances pin count and board area for dense designs.
• Commercial‑grade operating range: Surface‑mount, commercial device rated 0 °C to 85 °C for standard embedded and industrial control environments.

Why Choose XC6SLX150T-3CSG484C?

The XC6SLX150T-3CSG484C pairs a large complement of programmable logic and embedded memory with a high I/O count in a compact 484‑FBGA package, making it suitable for designs that require significant integration of digital functions on a single FPGA. Its low core voltage and commercial operating range provide predictable electrical and thermal characteristics for standard embedded applications.

This device is well suited to engineering teams and procurement organizations seeking a surface‑mount, RoHS‑compliant FPGA offering substantial logic resources and memory capacity within a compact footprint.

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