XC6SLX150T-3FG484I

The XC6SLX150T-3FG484I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD designed for industrial embedded applications. It provides a high logic element count and on-chip memory in a compact surface-mount 484‑BBGA package for dense, configurable digital designs.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 296 I/O pins, this device targets applications that require substantial programmable logic, flexible interfacing, and industrial temperature support.

Key Features

• Core Logic 147,443 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support data buffering, FIFOs, and on-chip storage for logic-intensive designs.
• I/O Capacity 296 user I/O pins to support a wide range of external interfaces and parallel or serial connectivity options.
• Power Device supply operates from 1.14 V to 1.26 V, allowing designers to plan power delivery and margining for the programmable core.
• Package and Mounting Surface-mount 484‑BBGA package; supplier device package also listed as 484‑FBGA (23×23) for compact board-level integration.
• Temperature and Grade Industrial grade with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Control — Implement motor control logic, sequencing, and real-time signal processing with the device’s high logic capacity and industrial temperature rating.
• Embedded Systems — Use the FPGA for custom accelerators, protocol bridging, or glue-logic in embedded platforms requiring substantial on-chip memory and I/O.
• Communications Equipment — Deploy the device where moderate to high logic density and flexible I/O are needed for packet processing, framing, or interface adaptation.

Unique Advantages

• High Logic Density: 147,443 logic elements enable implementation of large custom logic blocks and parallel processing functions without external ASICs.
• Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for buffering and low-latency data paths.
• Extensive I/O Resources: 296 I/O pins provide flexibility for connecting multiple peripherals, buses, and interfaces on a single FPGA.
• Industrial Temperature Support: Rated from −40°C to 100°C to meet the thermal demands of industrial deployments.
• Compact Surface-Mount Package: 484‑BBGA / 484‑FBGA (23×23) packaging supports high-density board layouts while maintaining robust electrical connections.
• RoHS Compliance: Meets regulatory requirements for hazardous substance restrictions.

Why Choose XC6SLX150T-3FG484I?

The XC6SLX150T-3FG484I positions itself as a high-density, industrial-grade FPGA option for designs that require a large number of logic elements, substantial on-chip RAM, and broad I/O capability in a compact surface-mount package. Its supply voltage range and temperature rating allow designers to plan for industrial system constraints with clear, specific electrical and environmental parameters.

Suitable for engineering teams building industrial control systems, embedded platforms, or communications equipment, this AMD Spartan®-6 LXT device provides a balance of logic capacity, memory, and I/O that supports consolidation of functions and simplification of board-level designs.

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