XC6SLX150T-3FG900I

The XC6SLX150T-3FG900I is a Spartan®-6 LXT FPGA from AMD supplied in a 900-ball BGA package. It provides a large pool of programmable logic and on-chip memory along with a high I/O count, making it suitable for industrial-grade programmable logic designs.

Key silicon attributes include 147,443 logic elements, approximately 4.94 Mbits of embedded memory, 540 I/O pins, a 1.14 V–1.26 V core supply range, and an operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic  147,443 logic elements and 11,519 configurable logic blocks (CLBs) provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support data buffering, state storage, and logic-local memory requirements.
• High I/O Count  540 available I/O pins to accommodate dense peripheral interfacing and multi-channel connectivity.
• Power  Core voltage supply range of 1.14 V to 1.26 V for compatibility with specified FPGA core power requirements.
• Package and Mounting  900-ball BGA package (supplier device package: 900-FBGA, 31 × 31) designed for surface-mount assembly.
• Temperature and Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic implementations that require industrial operating temperatures and a large number of I/O for sensor and actuator interfaces.
• High-density I/O Systems  Designs that demand many external connections—such as multi-channel acquisition or aggregation—benefit from the 540 I/O pins.
• On-chip Data Buffering  Applications needing embedded memory for temporary storage or buffering can leverage approximately 4.94 Mbits of RAM.

Unique Advantages

• High logic capacity: 147,443 logic elements enable implementation of large, complex logic functions without immediate need for external logic.
• Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-machine tasks.
• Extensive I/O: 540 I/O pins support dense external interfacing and flexible signal routing options.
• Industrial temperature rating: Rated from -40 °C to 100 °C for reliability in temperature-demanding operational environments.
• Compact BGA package: 900-ball (31 × 31) BGA provides a high pin-count footprint in a compact surface-mount form factor.
• Regulatory compliance: RoHS compliant to meet environmental directives.

Why Choose XC6SLX150T-3FG900I?

The XC6SLX150T-3FG900I combines a large logic fabric, multi-megabit embedded RAM, and a high I/O count in a compact 900-ball BGA package targeted at industrial-grade applications. Its specified core voltage range and broad operating temperature make it a solid option where robustness and integration density are priorities.

This device is suitable for designers who need significant on-chip resources and extensive external connectivity while maintaining industrial operating margins. Its combination of logic, memory, and I/O supports scalable designs that consolidate functions onto a single FPGA device.

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