XC6SLX150T-3FG676I

The XC6SLX150T-3FG676I is a Spartan®-6 LXT field programmable gate array (FPGA) provided in a 676-ball BGA package. It combines a large programmable fabric with substantial embedded RAM and a high pin count to support complex, I/O‑dense designs in industrial environments.

Key Features

• Core Logic  147,443 logic elements and 11,519 configurable logic blocks (CLBs) provide a sizeable programmable fabric for implementing custom logic and control functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM supports buffering, lookup tables, and state storage for data‑intensive logic.
• I/O Density  396 user I/O pins enable connectivity to a wide range of external devices and high‑pin‑count system interfaces.
• Power  Supported core voltage range of 1.14 V to 1.26 V for the device core supply.
• Package & Mounting  676‑BGA (supplier package: 676‑FBGA, 27×27 mm) in a surface‑mount form factor for compact board integration.
• Temperature & Grade  Industrial grade operation with an operating temperature range of −40°C to 100°C, suitable for temperature‑challenging environments.
• Compliance  RoHS compliant, supporting lead‑free assembly and regulatory requirements for many production environments.

Typical Applications

• Industrial Control  The industrial temperature rating and high I/O count make this FPGA suitable for control logic, I/O aggregation, and protocol handling in industrial automation systems.
• Embedded Systems  Large logic capacity and on‑chip RAM enable integration of custom processing, glue logic, and peripheral interfaces in embedded designs.
• Communication Interfaces  High pin count and programmable fabric support implementation of custom protocol adapters and I/O‑heavy interface functions.

Unique Advantages

• Substantial Logic Capacity:  147,443 logic elements and 11,519 CLBs provide the resources to consolidate multiple discrete functions into a single device, reducing overall system complexity.
• On‑chip Memory Availability:  Approximately 4.94 Mbits of embedded RAM enables local buffering and fast data handling without immediate reliance on external memory.
• High I/O Count:  396 user I/Os allow direct interfacing to numerous peripherals and parallel buses, minimizing external glue logic.
• Industrial Temperature Range:  Rated for −40°C to 100°C operation, supporting deployment in environments with wide temperature variation.
• Compact BGA Package:  676‑FBGA (27×27 mm) offers a high‑density, surface‑mount solution that helps optimize board area while providing robust connectivity.
• RoHS Compliant:  Conforms to lead‑free assembly requirements for environmentally conscious manufacturing and regulatory compliance.

Why Choose XC6SLX150T-3FG676I?

The XC6SLX150T-3FG676I positions itself as a high‑capacity Spartan®‑6 LXT FPGA option for designers needing substantial logic resources, embedded memory, and a large number of I/Os in an industrial‑rated package. Its combination of logic elements, on‑chip RAM, and 396 I/Os enables consolidation of complex control, interfacing, and data‑handling tasks onto a single programmable device.

This device is well suited to engineering teams building industrial control, embedded processing, or communication interface solutions that require a robust temperature range, compact BGA packaging, and RoHS compliance. Its specification set supports scalable designs where integration and board‑level density are key considerations.

Request a quote or submit an inquiry for pricing and availability to begin integrating the XC6SLX150T-3FG676I into your next design.