XC6SLX150T-3FG900C

The XC6SLX150T-3FG900C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 900-ball BBGA package. It provides a high count of programmable logic resources, on-chip memory, and I/O suitable for commercial electronic designs that require flexible digital logic implementation.

Key Features

• Logic Capacity  Approximately 147,443 logic elements for implementing complex custom digital functions and parallel datapaths.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for high-throughput designs.
• I/O Resources  540 I/O pins to accommodate wide external interfacing and multi-channel connectivity requirements.
• Package and Mounting  900-BBGA supplier package (900-FBGA, 31 × 31 mm) with surface-mount construction for compact board integration.
• Power  Specified core supply range of 1.14 V–1.26 V to match system power-rail planning.
• Operating Range  Commercial temperature grade with an operating range of 0 °C–85 °C for standard commercial deployments.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom digital logic  Implement application-specific finite state machines, protocol handlers, and glue logic in commercial products.
• High-density I/O interfacing  Consolidate multiple peripheral interfaces and parallel data channels using the device’s 540 I/O pins.
• On-chip buffering and control  Leverage the approximately 4.94 Mbits of embedded memory for buffering, local storage, and control structures.

Unique Advantages

• High logic density:  Approximately 147,443 logic elements enable substantial functional integration on a single device, reducing external components.
• Extensive I/O capability:  540 I/O pins support broad connectivity for complex boards and multi-channel systems.
• Significant embedded memory:  About 4.94 Mbits of on-chip RAM simplifies data buffering and reduces dependence on external memory.
• Compact, surface-mount package:  900-BBGA (31 × 31 mm) package provides a high-pin-count solution in a board-friendly form factor.
• Commercial temperature rating:  0 °C–85 °C operation aligns with standard commercial product environments.
• RoHS compliant:  Meets common environmental compliance expectations for modern electronics manufacturing.

Why Choose XC6SLX150T-3FG900C?

The XC6SLX150T-3FG900C delivers a combination of large programmable logic resources, substantial embedded memory, and a high I/O count in a compact 900-BBGA package, making it well suited for commercial designs that require dense logic integration and broad interfacing. Its specified core voltage range and commercial operating temperature make it appropriate for standard commercial electronic applications where flexible, field-programmable functionality is needed.

As part of the Spartan®-6 LXT family from AMD, this device addresses projects that prioritize on-chip resources and I/O capacity while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry for pricing and availability of the XC6SLX150T-3FG900C to move your design from concept to production.