XC6SLX150T-3FGG676C

The XC6SLX150T-3FGG676C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) offered in a 676-ball BGA package. It provides a high density of programmable logic, embedded memory, and I/O resources suitable for commercial electronic designs.

With a core voltage range optimized for low-voltage operation and a commercial operating temperature rating, this device targets board-level applications that require significant programmable logic capacity and extensive I/O integration.

Key Features

• Logic Capacity  Provides 147,443 logic elements for implementing complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Resources  396 I/O signals to support multiple interfaces and high channel counts at the board level.
• Package and Mounting  Available in a 676-FBGA (27×27) package; surface-mount mounting type simplifies PCB assembly for compact, high-density designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match low-voltage system power domains.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant to support lead-free manufacturing requirements.

Typical Applications

• Custom digital logic and signal processing  High logic element count and embedded RAM enable implementation of complex processing pipelines and custom accelerators.
• Board-level I/O expansion and interface bridging  396 I/Os make the device well-suited for connecting multiple peripherals and protocol bridges on a single PCB.
• Prototyping and validation  Programmable logic density supports proof-of-concept development and functional verification of digital designs.

Unique Advantages

• High logic density: 147,443 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM count and board complexity.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM supports local buffering and state storage without external memory.
• Extensive I/O: 396 I/Os provide flexibility for multi-channel interfaces, sensor arrays, or high-pin-count peripherals.
• Compact BGA footprint: 676-FBGA (27×27) package enables high-density PCB layouts while maintaining a surface-mount form factor.
• Low-voltage core operation: 1.14 V to 1.26 V core supply aligns with modern low-voltage power domains to simplify power architecture.
• RoHS compliant, commercial grade: Meets lead-free assembly requirements and is specified for commercial temperature ranges.

Why Choose XC6SLX150T-3FGG676C?

The XC6SLX150T-3FGG676C positions itself as a high-density, commercially graded Spartan®-6 LXT FPGA that balances large programmable logic capacity, on-chip memory, and a high I/O count within a compact 676-FBGA package. Its low-voltage core and surface-mount form factor make it suitable for board-level designs where PCB space, integration, and programmable flexibility are priorities.

This device is appropriate for designers and procurement teams seeking a robust FPGA for custom logic implementation, interface consolidation, and prototyping in commercial electronic products. Its combination of logic density, embedded memory, and extensive I/O supports scalable designs and helps simplify system-level integration.

To request a quote or submit an inquiry for XC6SLX150T-3FGG676C, reference the full part number and provide your quantity and delivery requirements.