XC6SLX150T-4CSG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 147443 484-FBGA, CSPBGA |
|---|---|
| Quantity | 542 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CSPBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA, CSPBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11519 | Number of Logic Elements/Cells | 147443 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX150T-4CSG484C – Spartan®-6 LXT FPGA, 484‑FBGA, 296 I/Os
The XC6SLX150T-4CSG484C is a Spartan®-6 LXT field programmable gate array (FPGA) supplied in a 484‑ball CSPBGA (484‑FBGA) package. It provides high logic capacity and substantial on‑chip memory in a surface‑mount package suited for commercial temperature range designs. Typical use cases include custom digital logic implementation where large numbers of I/O and embedded RAM are required.
Key Features
- High Logic Capacity — 147,443 logic elements for implementing complex digital logic and custom architectures.
- Embedded Memory — Approximately 4.94 Mbits of on‑chip RAM to support buffering, FIFOs, and small embedded data stores without external memory.
- I/O Density — 296 I/Os to connect to multiple peripherals, buses, and external devices within a single device footprint.
- Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V, providing defined supply requirements for system power design.
- Package and Mounting — 484‑FBGA (484‑CSPBGA, 19×19) surface‑mount package for compact board layouts and automated assembly.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
- RoHS Compliant — Meets RoHS environmental requirements for lead‑free manufacturing.
Typical Applications
- High‑density digital processing — Implement custom signal processing pipelines and parallel logic using the device’s large pool of logic elements.
- Interface aggregation — Consolidate multiple peripheral interfaces and control logic into a single FPGA leveraging 296 I/Os.
- Embedded buffering and control — Use the approximately 4.94 Mbits of on‑chip RAM for frame buffers, FIFOs, and small embedded data stores to reduce external memory needs.
Unique Advantages
- Substantial logic resources: 147,443 logic elements provide headroom for complex designs and integration of multiple functions on one device.
- Significant on‑chip RAM: Approximately 4.94 Mbits of embedded memory reduces dependency on external RAM for many buffering and control tasks.
- High I/O count: 296 I/Os enable flexible system integration and support for numerous interfaces without additional multiplexing hardware.
- Compact, assembly‑friendly package: The 484‑FBGA (19×19) CSPBGA surface‑mount package supports dense PCB layouts and automated manufacturing.
- Clear power requirements: Defined core voltage range (1.14 V to 1.26 V) simplifies power‑supply planning and validation.
- RoHS compliant: Facilitates use in lead‑free production environments.
Why Choose XC6SLX150T-4CSG484C?
The XC6SLX150T-4CSG484C combines a large logic fabric with substantial embedded memory and a high I/O count in a compact 484‑FBGA package. Its commercial temperature rating and surface‑mount form factor make it suitable for a wide range of standard commercial electronic designs that require on‑device resources to minimize external components.
This part is well suited for teams and designs that need scalable logic capacity, meaningful on‑chip RAM for buffering or control functions, and a high number of I/Os while maintaining compact board placement and RoHS compliance.
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