XC6SLX150T-4FGG676C

The XC6SLX150T-4FGG676C is a Spartan®-6 LXT family FPGA from AMD, offering a high-density programmable logic device in a 676-BGA package. It provides 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 396 I/O pins for designs that require substantial on-chip resources and flexible connectivity.

Designed for surface-mount assembly and commercial-grade operation, this device operates from a core supply of 1.14 V to 1.26 V and is specified for an ambient temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Core Logic  147,443 logic elements provide a large, programmable fabric for complex digital functions and custom logic implementations.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables and local data storage without external memory.
• I/O Capacity  396 general-purpose I/O pins enable wide external interfacing and parallel connectivity for high-pin-count designs.
• Package  676-FBGA (27 × 27 mm) BGA package for compact, high-density board integration and surface-mount assembly.
• Power  Core voltage range of 1.14 V to 1.26 V to match system power rails and design requirements for the Spartan‑6 LXT architecture.
• Thermal and Grade  Commercial operating range of 0 °C to 85 °C suitable for standard temperature environments.
• Compliance  RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• Custom Digital Logic  Implement user-defined digital functions and hardware accelerators using the device’s large logic capacity.
• Memory-Intensive Designs  Use the approximately 4.94 Mbits of embedded RAM for buffering, FIFOs, and local data storage to reduce external memory needs.
• I/O-Heavy Interfaces  Leverage 396 I/O pins for systems requiring multiple parallel interfaces, sensor arrays, or multi-channel connectivity.
• Compact Board Designs  The 676-FBGA package supports high-density, surface-mount PCB layouts where board space is at a premium.

Unique Advantages

• High Logic Density: 147,443 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level complexity.
• Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM lowers dependence on external memory, simplifying BOM and board routing.
• Extensive I/O: 396 I/O pins provide design flexibility for parallel data paths and diverse peripheral connections.
• Compact BGA Package: 676-FBGA (27 × 27 mm) combines high pin count with a compact footprint for space-constrained applications.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.

Why Choose XC6SLX150T-4FGG676C?

The XC6SLX150T-4FGG676C delivers a balance of high logic capacity, substantial embedded memory, and broad I/O in a compact 676-FBGA package. It is well suited for engineers who need a programmable solution that consolidates functions, reduces external components, and supports I/O-rich designs within commercial temperature ranges.

With clear electrical and mechanical specifications—including a 1.14 V to 1.26 V core supply range, surface-mount 676-FBGA packaging, and RoHS compliance—this Spartan‑6 LXT FPGA provides a verifiable platform for scalable, robust digital designs.

Request a quote or submit your requirements for the XC6SLX150T-4FGG676C to receive pricing and availability information tailored to your project needs.