XC6SLX150T-N3CSG484C

IC FPGA 296 I/O 484CSBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 147443 484-FBGA, CSPBGA

Quantity 1,147 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGA, CSPBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11519Number of Logic Elements/Cells147443
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX150T-N3CSG484C – Spartan®-6 LXT FPGA, 484‑FBGA (Commercial)

The XC6SLX150T-N3CSG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC designed for commercial embedded systems and programmable digital logic. It provides a substantial logic resource and on-chip memory capacity in a 484‑FBGA (19×19) surface-mount package for compact board-level integration.

Key Features

  • Core Logic Approximately 147,443 logic elements for implementing complex custom logic and control functions.
  • Embedded Memory Approximately 4.94 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
  • I/O Capacity 296 user I/O pins to support multiple interfaces and peripheral connections.
  • Power Low-voltage core supply range from 1.14 V to 1.26 V to match system power rails and support efficient operation.
  • Package & Mounting 484‑FBGA, CSPBGA (19×19) package designed for surface-mount assembly and compact PCB layouts.
  • Operating Range Commercial temperature specification from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant for lead-free design and regulatory alignment in commercial products.

Typical Applications

  • Commercial Embedded Systems — Implement custom control logic, interface aggregation, and system orchestration in space-constrained designs.
  • Prototyping and Development — Validate hardware architectures and iterate firmware with a large logic fabric and abundant I/O.
  • High-Density Glue Logic — Consolidate multiple discrete functions into a single programmable device to reduce BOM and simplify board layouts.

Unique Advantages

  • Substantial Logic Capacity: Approximately 147,443 logic elements enable implementation of complex state machines, custom accelerators, and system glue logic.
  • Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for many buffering and LUT needs.
  • Versatile I/O Count: 296 I/O pins support multiple peripherals and parallel interfaces without extensive external multiplexing.
  • Compact Surface-Mount Package: 484‑FBGA (19×19) package supports high-density PCB designs while maintaining assembly compatibility.
  • Commercial-Grade Ready: 0 °C to 85 °C operating range and RoHS compliance align with commercial product requirements and regulatory expectations.

Why Choose XC6SLX150T-N3CSG484C?

The XC6SLX150T-N3CSG484C combines a large logic fabric, substantial embedded memory, and extensive I/O in a compact 484‑FBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial embedded designs that require programmable logic density and on-board memory.

This part is well suited to engineers and product teams looking to consolidate multiple functions into a single FPGA, accelerate prototypes into production, or scale digital designs while maintaining a compact footprint and straightforward supply-chain compliance.

Request a quote or submit a sales inquiry to check availability and pricing for the XC6SLX150T-N3CSG484C.

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