XC6SLX150T-N3FG484I

The XC6SLX150T-N3FG484I is a Spartan‑6 LXT field programmable gate array (FPGA) from AMD designed for industrial applications. It provides a substantial logic resource and on-chip memory in a compact 484‑ball BGA package, making it suitable for embedded control, I/O-intensive designs, and systems that require operation across extended temperature ranges.

Key value comes from a large number of logic elements, significant embedded RAM, and a high I/O count, combined with an industrial operating temperature rating and RoHS compliance for reliable deployment in demanding environments.

Key Features

• Core / Architecture Spartan‑6 LXT FPGA architecture in the XC6SLX150T‑N3FG484I package, delivering programmable logic resources for custom digital design.
• Logic Capacity Approximately 147,443 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory Approximately 4.94 Mbits of on‑chip RAM for data buffering, FIFOs, and small on‑chip storage needs.
• I/O Count 296 user I/O pins to support dense peripheral interfacing and multi‑channel connectivity.
• Power Core voltage supply range of 1.14 V to 1.26 V for the FPGA core power domain.
• Package & Mounting 484‑BBGA package case with supplier package 484‑FBGA (23×23) and surface‑mount mounting for compact board designs.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Environmental Compliance RoHS compliant to meet common regulatory requirements for electronic assemblies.

Typical Applications

• Industrial Control Use the large logic capacity and robust temperature rating for real‑time control, motor management, and PLC subsystems.
• Embedded Systems Leverage on‑chip RAM and high I/O count for data handling, peripheral aggregation, and custom protocol implementation.
• Communications & Networking Implement protocol bridging, packet processing, and interface adaptation using the FPGA’s logic and I/O resources.

Unique Advantages

• High Logic Integration: Around 147,443 logic elements provide headroom for complex designs and multi‑function implementations without external logic.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Large I/O Count: 296 I/Os enable direct connection to multiple sensors, actuators, and peripherals, simplifying system BOM and board routing.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C for reliable operation in harsh or variable thermal environments.
• Compact BGA Footprint: 484‑BBGA / 484‑FBGA (23×23) packaging supports high‑density PCB layouts while maintaining robust electrical performance.
• Regulatory Compliance: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose XC6SLX150T-N3FG484I?

The XC6SLX150T-N3FG484I balances substantial programmable logic and on‑chip memory with a high I/O count in a compact industrial‑grade BGA package. It is well suited for engineers and system designers building embedded controllers, communication interfaces, and industrial automation equipment that require a durable FPGA platform.

As a part of the Spartan‑6 LXT family from AMD, this device offers a clear combination of integration, thermal tolerance, and I/O flexibility to support medium‑ to high‑complexity designs where long‑term robustness and predictable electrical characteristics are important.

Request a quote or submit an inquiry to learn more about availability and pricing for the XC6SLX150T-N3FG484I. Our team can provide technical details and support to help evaluate this FPGA for your next design.