XC6SLX150T-N3FG900I

The XC6SLX150T-N3FG900I is an AMD Spartan®-6 LXT field programmable gate array (FPGA) supplied in a 900-ball BGA package for surface-mount applications. It delivers a balanced combination of logic capacity, embedded memory and large I/O count suitable for demanding industrial designs.

Key silicon characteristics include approximately 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 540 user I/O. The device operates from a 1.14 V to 1.26 V core supply and is specified for industrial temperature operation from -40 °C to 100 °C. The part is RoHS compliant.

Key Features

• Core Architecture Spartan®-6 LXT FPGA architecture in an XC6SLX150T device family configuration, offering programmable logic for custom hardware functions.
• Logic Capacity Approximately 147,443 logic elements (cells) to support complex digital designs and parallel processing tasks.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, table storage and local data processing without external memory.
• I/O Density 540 user I/O pins provide broad external interfacing options for sensors, peripherals and high-pin-count connectivity.
• Power Core voltage specified from 1.14 V to 1.26 V to match system power-rail planning and regulator selection.
• Package & Mounting 900-ball BGA (supplier device package: 900-FBGA, 31 × 31) in a surface-mount form factor for compact, high-density board layouts.
• Temperature & Grade Industrial-grade device rated for operation from -40 °C to 100 °C for reliable field deployment in industrial environments.
• Regulatory RoHS compliant, meeting common environmental and materials requirements for modern manufacturing.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature range and robust logic capacity make the device suitable for programmable controllers and machine automation functions.
• I/O-Intensive Systems — High I/O count supports data aggregation, multi-sensor interfaces and complex peripheral connectivity.
• Memory-Driven Processing — Approximately 4.94 Mbits of embedded RAM supports local buffering and real-time data handling in signal processing tasks.
• Custom Logic and Prototyping — Large logic element count enables implementation of custom accelerators, protocol engines and proof-of-concept hardware designs.

Unique Advantages

• High logic density: Approximately 147,443 logic elements provide headroom for complex state machines, parallel datapaths and feature-rich designs.
• Substantial embedded memory: Nearly 5 Mbits of on-chip RAM reduces dependence on external memory and simplifies board-level BOM.
• Extensive I/O capability: 540 user I/O pins allow flexible interfacing and system partitioning without additional I/O expanders.
• Industrial robustness: Rated for -40 °C to 100 °C operation to meet environmental demands of industrial deployments.
• Compact, high-density package: 900-ball BGA (900-FBGA, 31 × 31) supports space-constrained designs while maintaining connectivity.
• Regulatory compliance: RoHS compliance aligns with common manufacturing and material requirements.

Why Choose XC6SLX150T-N3FG900I?

The XC6SLX150T-N3FG900I positions itself as a capable, industrial-grade Spartan®-6 LXT FPGA option for engineers who require large programmable logic resources, significant on-chip RAM and a high number of I/Os in a compact BGA package. Its voltage and temperature specifications support integration into controlled power domains and industrial environments.

This device is suitable for design teams implementing high-density custom logic, I/O-rich systems or memory-dependent processing where a balance of integration, scalability and environmental tolerance is required.

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