XC6SLX150T-N3FG676C

The XC6SLX150T-N3FG676C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD, provided in a 676-ball BGA package. It delivers high logic density and on-chip memory in a commercial-grade, surface-mount device suitable for designs that require substantial programmable logic, plentiful I/O, and a compact package.

Key attributes include 147,443 logic elements, approximately 4.94 Mbits of embedded RAM, and 396 general-purpose I/O, all operating over a core supply range of 1.14 V to 1.26 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  147,443 logic elements provide a high-density fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM (4,939,776 bits) supports buffering, data storage, and memory-intensive logic blocks.
• I/O Capacity  396 general-purpose I/O pins enable extensive interfacing and connectivity options on a single device.
• Power  Core supply operates from 1.14 V to 1.26 V, allowing designers to plan power delivery and decoupling for stable core operation.
• Package & Mounting  Supplied in a 676-ball FBGA (27×27 mm) package for surface-mount assembly, facilitating compact PCB layouts and high I/O density.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Typical Applications

• Custom Logic Prototyping  Implement and iterate complex digital logic and prototypes using the device’s high logic element count and embedded RAM.
• High-density I/O Interfaces  Leverage 396 I/O to connect multiple peripherals, sensors, or interface bridges on a single FPGA.
• On-chip Data Buffering  Use approximately 4.94 Mbits of embedded memory for local buffering, FIFOs, and small data stores within the FPGA fabric.
• Compact Board Designs  The 676-FBGA (27×27) package and surface-mount mounting support dense PCB implementations where board space is constrained.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of complex functions without adding external logic devices.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on off-chip memory for many buffering and storage tasks.
• Extensive I/O count: 396 I/O pins provide broad connectivity for parallel interfaces, control signals, and mixed-signal front-ends.
• Compact FBGA package: The 676-FBGA (27×27) package balances high pin count and a small footprint for space-conscious designs.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream electronic products and systems.
• Predictable core supply: A defined voltage supply range of 1.14 V to 1.26 V simplifies power rail design for the FPGA core.

Why Choose XC6SLX150T-N3FG676C?

XC6SLX150T-N3FG676C positions itself as a high-density, commercially graded Spartan‑6 LXT FPGA that combines a large count of logic elements, substantial embedded memory, and a broad I/O complement in a compact 676-FBGA package. Its defined core voltage range and surface-mount format make it suitable for designers targeting densely populated boards and robust programmable logic implementations.

This device is appropriate for engineering teams and procurement looking for a programmable IC that delivers integration and scalability within the commercial temperature range, backed by AMD’s Spartan-6 LXT family pedigree.

Request a quote or submit a procurement inquiry for XC6SLX150T-N3FG676C to receive pricing and availability details for your next design or production run.