XC6SLX150T-N3FGG484C

The XC6SLX150T-N3FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) in a 484-ball BGA package designed for commercial embedded designs. It delivers substantial logic and on-chip memory capacity with a wide I/O complement and a low-voltage core, making it suitable for compact, high-density digital implementations.

Key Features

• Logic Capacity  Approximately 147,443 logic elements, providing ample programmable resources for complex combinational and sequential logic.
• Logic Blocks  11,519 logic blocks (CLBs) to structure logic and control resources across the fabric.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Resources  296 I/O pins to support a broad range of peripheral interfaces and board-level connectivity.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting  484-BBGA (supplier package: 484-FBGA, 23 × 23 mm) in a surface-mount form factor for compact board layouts.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, supporting regulatory and assembly requirements.

Typical Applications

• High-density digital processing  Leverage ~147,443 logic elements and ~4.94 Mbits of embedded memory to implement complex logic, acceleration blocks, or protocol engines on a single device.
• I/O aggregation and protocol bridging  Use 296 I/O pins to consolidate multiple peripheral and bus interfaces in systems requiring flexible connectivity.
• Compact embedded systems  The 484-BBGA surface-mount package and commercial temperature grade make this FPGA suitable for space-constrained boards in consumer and industrial-electronics applications.

Unique Advantages

• Substantial programmable resources: The combination of large logic element count and many CLBs enables implementation of complex designs without splitting functionality across multiple devices.
• On-chip memory for integration: Nearly 5 Mbits of embedded RAM reduce external memory needs for buffering and temporary storage, simplifying BOM and board routing.
• Ample I/O for system integration: 296 I/Os support broad peripheral interfacing and help minimize additional interface components.
• Compact, manufacturable package: The 484-BBGA (23 × 23 mm) surface-mount package balances density and assembly suitability for modern PCB layouts.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial embedded products.
• Regulatory readiness: RoHS compliance supports modern electronics manufacturing and environmental requirements.

Why Choose XC6SLX150T-N3FGG484C?

The XC6SLX150T-N3FGG484C positions itself as a high-density, commercially graded FPGA option that combines large programmable logic capacity, significant on-chip RAM, and extensive I/O in a compact 484-BBGA surface-mount package. It is well suited to designers who need to consolidate complex logic, interface-rich functions, and embedded buffering into a single device while meeting commercial temperature and RoHS requirements.

Design teams building compact, I/O-intensive, or memory-aware embedded systems will find this device a practical choice for reducing board-level complexity, preserving PCB area, and aggregating functionality with a single FPGA solution.

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