XC6SLX150T-N3FG900C

The XC6SLX150T-N3FG900C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, delivered in a 900-ball BGA package. It provides a high logic element count and substantial on-chip memory in a commercial-grade, surface-mount package for general-purpose FPGA designs.

Key attributes include 147,443 logic elements, approximately 4.94 Mbits of embedded memory, 540 I/Os, a 1.14 V to 1.26 V core supply range, and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  147,443 logic elements support complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM provides storage for buffers, FIFOs, and local data structures.
• High I/O Count  540 I/O pins enable extensive external connectivity for interfaces, peripherals, and board-level integration.
• Power  Core supply voltage specified at 1.14 V to 1.26 V to match system power-rail requirements.
• Package & Mounting  900-BBGA package (supplier device package: 900-FBGA, 31×31) in a surface-mount form factor suitable for compact PCB designs.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for lead-free manufacturing and regulatory adherence.

Unique Advantages

• High logic capacity: 147,443 logic elements allow implementation of sizable digital designs without external logic expansion.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O resources: 540 I/Os simplify interfacing to multiple peripherals and parallel buses, minimizing board-level multiplexing.
• Compact, surface-mount package: The 900-BBGA / 900-FBGA (31×31) package supports dense board layouts while maintaining robust connectivity.
• Commercial-grade and RoHS compliant: Designed for standard commercial temperature ranges and lead-free manufacturing environments.

Why Choose XC6SLX150T-N3FG900C?

The XC6SLX150T-N3FG900C combines a large logic fabric, significant embedded memory, and a high I/O count in a compact 900-BBGA surface-mount package, making it well suited to commercial FPGA designs that require integration of complex digital functions and extensive external interfacing. With a defined core voltage range and a commercial operating temperature rating, it fits into designs where predictability and established device characteristics are required.

As an AMD Spartan®-6 LXT device, this FPGA is appropriate for designers seeking a commercially graded, RoHS-compliant programmable logic solution with substantial on-chip resources and a high-density package footprint.

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