XC6SLX150T-N3FGG676C

The XC6SLX150T-N3FGG676C is a Spartan®-6 LXT field-programmable gate array (FPGA) from AMD, offered in a 676-FBGA (27×27) surface-mount package. It targets commercial-grade designs that require a high logic count, substantial on-chip memory, and a large number of I/O pins within a compact BGA footprint.

With approximately 147,443 logic elements, roughly 4.94 Mbits of embedded memory, and support for 396 I/O signals, this device is suited to applications where dense custom logic and broad external interfacing are primary requirements while operating over a commercial temperature range.

Key Features

• Logic Capacity  Approximately 147,443 logic elements provide substantial programmable logic resources for implementing complex state machines, control logic, and custom datapaths.
• Configurable Logic Blocks (CLBs)  11,519 CLBs furnish the device's core programmable fabric for building combinational and sequential logic structures.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM supports buffering, FIFOs, and small on-chip data stores without external memory.
• I/O Density  396 available I/O pins enable extensive interfacing to peripherals, sensors, and external controllers in high-pin-count designs.
• Package & Mounting  676-FBGA (27×27) package in a surface-mount form factor offers a compact, high-density solution for PCBs requiring substantial logic and I/O integration.
• Power  Specified core voltage supply range from 1.14 V to 1.26 V for the device core.
• Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density custom logic  Deploy where substantial programmable logic is required to implement complex finite state machines, control logic, or protocol handling using ~147,443 logic elements.
• Memory-intensive functions  Use the approximately 4.94 Mbits of embedded memory for buffering, small on-chip data structures, and intermediate storage without immediate reliance on external RAM.
• I/O-heavy systems  Integrate with multiple peripherals and interfaces that demand a large number of I/O signals—396 I/Os provide broad connectivity options.
• Compact board designs  The 676-FBGA (27×27) surface-mount package supports space-constrained PCBs that require a high logic and I/O density.

Unique Advantages

• High programmable capacity: The combination of ~147,443 logic elements and 11,519 CLBs delivers significant on-chip logic resources for complex implementations.
• Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O complement: 396 I/Os allow for extensive peripheral interfacing and system expansion without additional bridge devices.
• Compact, high-density package: 676-FBGA (27×27) provides a small PCB footprint while supporting a high pin count and surface-mount assembly.
• Commercial operating range: Specified for 0 °C to 85 °C operation, suitable for a wide range of commercial embedded systems.
• RoHS compliant: Meets RoHS requirements for reduced hazardous substances handling.

Why Choose XC6SLX150T-N3FGG676C?

The XC6SLX150T-N3FGG676C positions itself as a commercial-grade Spartan®-6 LXT FPGA option for designs that need a balance of high logic density, sizeable embedded RAM, and broad I/O capability in a compact BGA package. Its combination of approximately 147,443 logic elements, roughly 4.94 Mbits of on-chip memory, and 396 I/Os makes it well suited to mid- to high-complexity programmable applications where board space and interface count are key considerations.

Designed for developers and system integrators focusing on scalable, logic-intensive designs, this part delivers integration and flexibility while adhering to RoHS environmental standards and a defined commercial temperature range. It is appropriate for teams seeking a robust FPGA fabric with clear, verifiable hardware characteristics.

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