XC6SLX150T-N3FGG900C

The XC6SLX150T-N3FGG900C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, supplied in a 900-pin ball-grid array package. It provides a high density of programmable logic and on-chip memory for commercial embedded designs.

This device targets applications that require a large number of logic elements, substantial embedded RAM, and extensive I/O connectivity, while operating within a commercial temperature range and a defined core supply voltage window.

Key Features

• Logic Density — 147,443 logic elements providing substantial capacity for complex digital designs.
• Configurable Logic Blocks — 11,519 configurable logic blocks to organize and structure programmable logic resources.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage.
• I/O Count — 540 I/O pins to support high-density interfacing and multi-channel connectivity.
• Power and Core Voltage — Supported core voltage range of 1.14 V to 1.26 V for defined power planning and regulator selection.
• Package and Mounting — 900-BBGA package (supplier device package: 900-FBGA, 31 × 31) with surface-mount mounting type for compact board integration.
• Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High-density I/O systems — Use the 540 I/O pins to aggregate and interface with multiple sensors, peripherals, or bus interfaces.
• Memory-intensive embedded logic — Leverage approximately 4.94 Mbits of on-chip RAM for buffering, packet processing, or local data storage.
• Complex digital designs — Deploy large numbers of logic elements to implement state machines, datapaths, and custom accelerators within commercial products.

Unique Advantages

• High logic capacity: 147,443 logic elements enable substantial functional integration on a single device, reducing external components.
• Substantial embedded RAM: Approximately 4.94 Mbits of on-chip memory supports data buffering and reduces the need for external memory in many designs.
• Extensive I/O availability: 540 I/O pins allow flexible connectivity for multi-channel and multi-protocol designs.
• Compact, high-pin package: 900-BBGA / 900-FBGA (31 × 31) offers high pin count in a board-space-efficient form factor.
• Commercial temperature grading: Rated 0 °C to 85 °C to match typical commercial product deployment requirements.
• Regulatory compliance: RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose XC6SLX150T-N3FGG900C?

The XC6SLX150T-N3FGG900C positions itself as a high-capacity Spartan®-6 LXT FPGA option for commercial designs that need a balance of logic density, on-chip memory, and extensive I/O in a compact BGA package. With a clearly defined core voltage range and commercial temperature rating, it fits designs where predictable electrical and thermal characteristics are required.

Manufactured by AMD and provided in a 900-pin FBGA form factor, this device is suited to engineers and teams building complex digital systems that benefit from substantial programmable resources and on-chip RAM while maintaining board-level compactness and RoHS compliance.

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