XC6SLX16-2CPG196I

IC FPGA 106 I/O 196CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 106 589824 14579 196-TFBGA, CSBGA

Quantity 584 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package196-CSPBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case196-TFBGA, CSBGANumber of I/O106Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX16-2CPG196I – Spartan®-6 LX FPGA, 196‑TFBGA, Industrial

The XC6SLX16-2CPG196I is a Spartan®-6 LX field programmable gate array (FPGA) in a 196‑TFBGA / CSBGA package, offered in an industrial grade temperature range. It provides a balance of programmable logic, on-chip memory, and I/O suitable for designs that require moderate logic density with robust thermal and supply specifications.

Key on-chip resources include 14,579 logic elements, 1,139 configurable logic blocks (CLBs), and approximately 0.59 Mbits of embedded memory, along with 106 user I/O pins. The device is supplied for surface-mount assembly and operates from a core voltage range of 1.14 V to 1.26 V.

Key Features

  • Core Architecture Spartan®-6 LX FPGA family in part number XC6SLX16-2CPG196I, optimized for programmable logic integration.
  • Logic Resources Approximately 14,579 logic elements with 1,139 configurable logic blocks (CLBs) for implementing custom logic functions and state machines.
  • Embedded Memory Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, FIFOs, and small data structures.
  • I/O Capability 106 user I/O pins to interface with external peripherals, sensors, and buses.
  • Power Core supply voltage range of 1.14 V to 1.26 V to match platform power designs.
  • Package & Mounting 196‑TFBGA (CSBGA) package; supplier device package listed as 196‑CSPBGA (8×8). Surface-mount device suitable for PCB assembly.
  • Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Embedded system prototyping — Implement and iterate custom digital logic using the device’s 14,579 logic elements and on-chip RAM.
  • Industrial control — Deploy in control and monitoring systems that benefit from industrial temperature rating and surface-mount packaging.
  • I/O bridging and protocol handling — Use 106 I/O pins to connect multiple peripherals or handle protocol conversion tasks.
  • Low- to mid-density FPGA implementations — Suitable where moderate logic capacity and local memory are required without larger family complexity.

Unique Advantages

  • Right-sized logic capacity: 14,579 logic elements provide ample density for many mid-range FPGA tasks while keeping board-level complexity manageable.
  • On-chip memory available: Approximately 0.59 Mbits of embedded RAM reduces the need for external memory for small buffers and state storage.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployments in demanding thermal environments.
  • Flexible I/O count: 106 user I/O pins enable diverse peripheral interfacing and signal routing on constrained PCBs.
  • Compact surface-mount package: 196‑TFBGA / 196‑CSPBGA (8×8) supports high-density PCB implementations and automated assembly.
  • RoHS compliant: Meets common environmental compliance requirements for commercial and industrial products.

Why Choose XC6SLX16-2CPG196I?

The XC6SLX16-2CPG196I positions itself as a practical FPGA choice for designers seeking a moderate-density, industrial-grade programmable logic device. Its combination of 14,579 logic elements, roughly 0.59 Mbits of embedded memory, and 106 I/O pins provides a clear resource set for embedded systems, protocol handling, and control applications where temperature range and component footprint matter.

For teams focused on scalable, reliable designs with straightforward power and packaging requirements, this Spartan-6 LX device offers a compact option that aligns device resources directly with common mid-range FPGA needs while maintaining RoHS compliance.

Request a quote or submit a purchase inquiry for the XC6SLX16-2CPG196I to get pricing and availability for your next design.

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