XC6SLX16-2CSG225I

The XC6SLX16-2CSG225I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) in a 225-pin LFBGA CSP package designed for industrial applications. It provides programmable logic resources, embedded memory, and a broad I/O count for implementing custom digital functions and control logic.

With approximately 14,579 logic elements, roughly 0.59 Mbits of on-chip RAM, and 160 user I/O pins, this device targets systems that require flexible, reconfigurable logic in a compact surface-mount package over a wide operating temperature range.

Key Features

• Logic Capacity  Approximately 14,579 logic elements for implementing custom digital logic, state machines, and glue logic.
• On-Chip Memory  Approximately 0.59 Mbits of embedded RAM for buffering, FIFOs, and small local storage needs.
• I/O Resources  160 user I/O pins to support multiple peripheral interfaces and parallel connections in compact designs.
• Package  225-LFBGA (13 × 13) CSPBGA surface-mount package for space-constrained boards and high-density layouts.
• Power  Core supply range of 1.14 V to 1.26 V to match system power rails and support stable core operation within specified limits.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet elevated ambient and industrial environment requirements.
• Regulatory  RoHS compliant for reduced hazardous substance content in assemblies.

Typical Applications

• Industrial Control  Programmable logic and ample I/O make the device suitable for implementing custom control logic, signal aggregation, and interface translation in industrial systems.
• Embedded Systems  On-chip memory and logic capacity support glue logic, protocol handling, and peripheral management in embedded products.
• Communications Interfaces  High I/O count enables implementation of parallel interfaces, custom I/O banks, and protocol bridging between subsystems.

Unique Advantages

• Balanced Logic and Memory:  Approximately 14,579 logic elements combined with ~0.59 Mbits of RAM provides a compact, self-contained platform for control and data-path tasks without requiring large external memory.
• High I/O Density:  160 user I/Os enable multiple peripheral connections and flexible board-level integration, reducing the need for external IO expanders.
• Compact, Surface-Mount Package:  The 225-LFBGA (13 × 13) package supports space-constrained PCB designs while maintaining thermal and mechanical robustness for industrial use.
• Industrial Temperature Rating:  Rated from -40 °C to 100 °C to support deployments in harsher ambient conditions and extended-temperature installations.
• RoHS Compliant:  Meets environmental regulatory requirements for reduced hazardous substances in manufacturing.

Why Choose XC6SLX16-2CSG225I?

The XC6SLX16-2CSG225I offers a practical combination of programmable logic density, embedded RAM, and a substantial I/O complement in a compact 225-LFBGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications where environmental robustness and regulatory conformity are important.

This device is well suited for engineers designing space-efficient, reconfigurable systems that require reliable, on-chip logic and memory resources, and a versatile I/O footprint for connecting sensors, controllers, and peripheral devices.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX16-2CSG225I. Our team can assist with ordering and delivery details to support your project timeline.