XC6SLX16-2CSG324I

The XC6SLX16-2CSG324I is a Spartan‑6 LX field programmable gate array (FPGA) IC from AMD. It combines a mid-range logic fabric with embedded memory and a high I/O count to address designs that require flexible programmable logic in an industrial-grade package.

With 14,579 logic elements, approximately 0.59 Mbits of on-chip RAM and 232 user I/Os, the device delivers a balance of integration and I/O capability for systems operating across a wide industrial temperature range.

Key Features

• Core Logic  14,579 logic elements suitable for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support buffering, state machines, and small data storage requirements.
• I/O Count  232 user I/Os to support multiple external interfaces, sensors, and peripherals.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the FPGA core power domain.
• Package & Mounting  324‑LFBGA (324‑CSPBGA, 15×15) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• I/O‑Rich Interface and Bridging  Use the 232 I/Os to implement protocol bridging, bus interfacing, and peripheral aggregation in systems with multiple external connections.
• Industrial Control and Monitoring  Industrial temperature rating and rugged package make the device suitable for control logic, sensor aggregation, and supervisory functions in industrial equipment.
• Embedded Logic and Custom Acceleration  Implement custom state machines, data steering, and lightweight accelerator functions using the device’s 14,579 logic elements and embedded RAM.
• Prototyping and Low- to Mid‑Density Systems  Compact 324‑LFBGA packaging and moderate logic density support board-level prototypes and production designs where space and integration matter.

Unique Advantages

• Balanced Logic Density:  14,579 logic elements provide a mid-range capacity that supports a wide variety of custom logic functions without excessive area or power.
• Significant On‑Chip RAM:  Approximately 0.59 Mbits of embedded memory enables efficient local buffering and small data-store requirements without external memory.
• High I/O Integration:  232 user I/Os reduce external interface complexity and allow consolidation of multiple peripheral connections on a single device.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact Surface‑Mount Package:  324‑LFBGA (15×15) package enables dense PCB layouts while remaining compatible with standard assembly processes.
• RoHS Compliant:  Conforms to RoHS requirements for reduced hazardous substances.

Why Choose XC6SLX16-2CSG324I?

The XC6SLX16-2CSG324I delivers a pragmatic combination of logic capacity, embedded memory, and high I/O count in an industrial-grade, surface-mount 324‑LFBGA package. Its core voltage range and thermal rating make it suitable for designs that demand reliable operation across a wide temperature window while keeping board space and part count under control.

Manufactured by AMD, this Spartan‑6 LX FPGA is a fit for engineers and procurement teams seeking a scalable, mid-density programmable logic device for industrial control, interface consolidation, and embedded acceleration tasks.

Request a quote or submit an RFQ to receive pricing and availability information for the XC6SLX16-2CSG324I.