XC6SLX16-2FTG256I

The XC6SLX16-2FTG256I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, supplied in a 256-pin Labeled Ball Grid Array package. This industrial-grade, surface-mount device integrates a balanced combination of programmable logic, embedded memory, and I/O capability for designs requiring configurable digital resources within a defined power and temperature envelope.

Key on‑chip resources include 14,579 logic elements, approximately 0.59 Mbits of embedded memory, and 186 user I/O. The device operates from a core supply range of 1.14 V to 1.26 V and is specified for operation from −40 °C to 100 °C.

Key Features

• Logic Capacity 14,579 logic elements provide the device's programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.59 Mbits of on‑chip RAM for buffering, state storage, and small data structures within designs.
• I/O Resources 186 user I/O pins to support multiple interfaces, sensor connections, and peripheral signals in compact systems.
• Package and Mounting 256-LBGA package (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor suitable for modern PCB assembly.
• Power Core voltage supply specified from 1.14 V to 1.26 V to match defined power-domain requirements.
• Temperature Range Industrial-grade operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Manufacturer AMD device with RoHS compliance for regulatory alignment in assembly and production.

Typical Applications

• Industrial Control and Automation The industrial temperature rating and 186 I/O pins enable robust sensor, actuator, and motor-control interfaces in industrial equipment.
• Embedded System Integration On-chip logic and memory allow custom peripheral glue logic and data buffering for compact embedded controllers and prototyping platforms.
• Communication Interfaces Ample I/O count supports implementation of multiple serial, parallel, or custom interface endpoints within communication modules.

Unique Advantages

• Measurable Logic Density 14,579 logic elements provide defined capacity for partitioning control, signal processing, and glue logic without overspecifying the design.
• On‑Chip Memory Approximately 0.59 Mbits of embedded RAM reduces external memory dependencies for small buffers and state machines.
• Industrial Temperature Support Specified operation from −40 °C to 100 °C supports deployment in harsher environmental conditions common to industrial applications.
• Compact, Surface‑Mount Package 256-LBGA (256-FTBGA, 17×17) enables space-efficient board layouts and standard SMT assembly processes.
• Defined Core Power Envelope Operating voltage range of 1.14 V to 1.26 V allows predictable power planning for the FPGA core domain.
• Compliance RoHS-compliant construction aligns with environmental and manufacturing requirements.

Why Choose XC6SLX16-2FTG256I?

The XC6SLX16-2FTG256I positions itself as a practical, industrial-grade Spartan®-6 LX FPGA option where a known logic capacity, embedded memory, and a substantial I/O count are required in a compact surface-mount package. Its specified core voltage range and wide operating temperature window provide predictable electrical and environmental behavior for long-term deployment.

This device is well suited for engineers and procurement teams designing industrial controllers, embedded systems, and communication modules that need configurable logic resources with clear, verifiable specifications and RoHS-compliant manufacturing readiness.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX16-2FTG256I and discuss quantity, lead time, or supply options for your project.