XC6SLX16-3CSG225I
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 160 589824 14579 225-LFBGA, CSPBGA |
|---|---|
| Quantity | 870 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 225-CSPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-LFBGA, CSPBGA | Number of I/O | 160 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1139 | Number of Logic Elements/Cells | 14579 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC6SLX16-3CSG225I – Spartan®-6 LX FPGA, 160 I/O, 14,579 Logic Elements
The XC6SLX16-3CSG225I is a Spartan®-6 LX field programmable gate array (FPGA) in a 225‑LFBGA (13×13) package. It provides reconfigurable digital logic capacity and on‑chip embedded memory for mid-range programmable designs.
Designed for surface-mount applications with industrial grade qualification, this device targets designs that require a combination of logic density, a moderate number of I/O, and wide operating temperature support.
Key Features
- Core Logic 1139 configurable logic blocks (CLBs) and 14,579 logic elements provide the programmable logic resources for custom digital functions.
- Embedded Memory Approximately 0.59 Mbits of on‑chip RAM bits to support buffering, small FIFOs, and state storage.
- I/O 160 general-purpose I/O pins to interface with external peripherals and system signals.
- Power Supported voltage supply range from 1.14 V to 1.26 V for the core supply.
- Package & Mounting 225‑LFBGA, CSPBGA package (225‑CSPBGA, 13×13) in a surface‑mount form factor for compact board implementations.
- Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Use in control and monitoring systems that require industrial temperature operation and reconfigurable logic to adapt to changing system requirements.
- Embedded Systems Implement custom digital interfaces and glue logic where moderate logic density and up to 160 I/O are needed.
- Prototyping and Development Mid-range FPGA resource set suitable for validating designs and accelerating development of programmable hardware functions.
Unique Advantages
- Balanced Logic Capacity: 14,579 logic elements and 1139 CLBs provide a practical balance of resources for mid-range designs without excessive overhead.
- Compact BGA Package: 225‑LFBGA (13×13) package supports high‑density PCB layouts while maintaining a surface‑mount footprint.
- Robust Industrial Operation: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh environments.
- Ample I/O Count: 160 I/O pins accommodate multiple peripheral interfaces and system connections.
- On‑Chip Memory: Approximately 0.59 Mbits of embedded RAM for local buffering, state machines, and small data structures.
- Regulatory Compliance: RoHS compliance reduces environmental and regulatory risk for many product lines.
Why Choose XC6SLX16-3CSG225I?
The XC6SLX16-3CSG225I positions itself as a practical, industrial‑grade FPGA option for engineers needing reconfigurable logic, a moderate number of I/O, and reliable operation across a wide temperature range. Its combination of 14,579 logic elements, CLB count, and on‑chip memory supports a wide range of mid‑level digital functions while maintaining a compact BGA footprint.
This part is well suited for teams developing industrial control systems, embedded solutions, and hardware prototypes that require predictable supply voltage support and RoHS compliance. The device delivers a straightforward, verifiable specification set for designs that demand reconfigurable hardware with industrial robustness.
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Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








