XC6SLX16-3CSG225C

The XC6SLX16-3CSG225C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 225-ball LFBGA / CSPBGA package. It combines 1,139 configurable logic blocks (CLBs) delivering 14,579 logic elements with embedded on-chip memory and a 160‑pin I/O capability for flexible digital design.

Designed for commercial-grade applications, this surface-mount FPGA operates from a core supply range of 1.14 V to 1.26 V and supports an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 1,139 configurable logic blocks (CLBs) providing 14,579 logic elements for implementing custom digital logic and state machines.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 bits) to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources — 160 user I/O pins to support multiple interfaces and parallel connectivity options in a compact package.
• Power — Core supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
• Package & Mounting — 225-LFBGA / CSPBGA package (supplier device package: 225-CSPBGA (13×13)), surface-mount mounting for compact PCB implementations.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for commercial and industrial-ambient designs that fall within this range.
• RoHS Compliant — Device meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Custom Digital Logic — Implement application-specific datapaths, control logic, and state machines using the device’s 14,579 logic elements and 1,139 CLBs.
• Embedded Memory Structures — Use approximately 0.59 Mbits of on-chip RAM for buffering, small lookup tables, and local storage without relying on external memory.
• I/O and Interface Control — Leverage 160 I/O pins to bridge parallel interfaces, manage peripherals, and consolidate multiple signals in a single FPGA package.

Unique Advantages

• Balanced Logic and Memory: A combination of 14,579 logic elements and approximately 0.59 Mbits of embedded RAM supports mixed-control and data-path designs in a single device.
• Generous I/O Count: 160 user I/Os provide the flexibility to interface with a wide range of peripherals and parallel buses without external expanders.
• Compact Surface-Mount Package: 225-LFBGA / 225-CSPBGA (13×13) packaging enables dense PCB layouts while maintaining robust signal routing.
• Defined Power Envelope: A core voltage range of 1.14 V to 1.26 V allows predictable integration into low-voltage power domains.
• Commercial Temperature Rating: Rated from 0 °C to 85 °C to support standard commercial applications.
• RoHS Compliance: Facilitates lead-free manufacturing processes and regulatory compliance.

Why Choose XC6SLX16-3CSG225C?

The XC6SLX16-3CSG225C positions itself as a versatile, commercial-grade Spartan®-6 LX FPGA that combines moderate logic capacity, embedded memory, and a substantial I/O complement in a compact 225-ball BGA package. Its defined core voltage range and temperature rating make it straightforward to integrate into standard embedded designs where predictable electrical and thermal behavior is required.

This device is suited for designers seeking a balanced FPGA solution for custom digital implementations, on-chip buffering, and interface consolidation. With RoHS compliance and surface-mount packaging, it supports contemporary assembly processes and compact board layouts.

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