XC6SLX16-3CPG196C

IC FPGA 106 I/O 196CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 106 589824 14579 196-TFBGA, CSBGA

Quantity 215 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package196-CSPBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case196-TFBGA, CSBGANumber of I/O106Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX16-3CPG196C – Spartan®-6 LX FPGA, 14,579 logic elements, 106 I/Os, 196-TFBGA

The XC6SLX16-3CPG196C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, provided in a 196-TFBGA (CSBGA) package. It combines programmable logic resources, embedded RAM and flexible I/O in a commercial-grade FPGA targeted at embedded and system integration designs.

With 14,579 logic elements, approximately 0.59 Mbits of embedded memory and 106 I/O pins, this device addresses applications that require on-chip logic capacity, moderate memory and compact surface-mount packaging.

Key Features

  • Logic Capacity — 14,579 logic elements for implementing custom digital functions and control logic.
  • Configurable Logic Blocks (CLBs) — 1,139 CLBs for structured logic partitioning and design organization.
  • Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for buffering, FIFOs or small data stores within designs.
  • Flexible I/O — 106 user I/O pins to interface with peripherals, sensors and external logic.
  • Power Supply — Core voltage range of 1.14 V to 1.26 V to match system power rail requirements.
  • Package & Mounting — 196-TFBGA, CSBGA package (supplier device package: 196-CSPBGA, 8×8) with surface-mount mounting for compact PCB layouts.
  • Commercial Grade Temperature — Rated for 0 °C to 85 °C operation, suitable for commercial embedded environments.
  • RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Commercial Embedded Systems — Implements custom control logic and glue logic in commercial devices where a compact FPGA and moderate memory are required.
  • Prototyping and Development — Provides programmable resources for validating algorithms and digital designs prior to production.
  • Peripheral & I/O Bridging — Acts as a configurable interface hub for connecting disparate peripherals using available I/O pins.
  • Data Buffering and Small-Scale Processing — Uses on-chip RAM for temporary data storage, buffering and simple processing tasks within a system.

Unique Advantages

  • Balanced Logic and Memory: 14,579 logic elements and ~0.59 Mbits of embedded RAM support a wide range of mid-range logic and buffering requirements without external memory.
  • Ample I/O Count: 106 I/Os simplify direct interfacing to multiple peripherals and signals, reducing the need for external I/O expanders.
  • Compact Surface-Mount Package: 196-TFBGA (196-CSPBGA, 8×8) package enables space-efficient PCB integration for compact designs.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
  • Low-Voltage Core Operation: Core supply between 1.14 V and 1.26 V supports modern low-voltage system architectures.
  • Regulatory Compliance: RoHS compliance supports lead-free assembly processes and environmental requirements.

Why Choose XC6SLX16-3CPG196C?

The XC6SLX16-3CPG196C positions itself as a compact, commercial-grade FPGA option that blends a substantial logic element count with embedded RAM and a significant number of I/Os in a surface-mount BGA footprint. It is well suited for designers building commercial embedded systems, prototyping digital functions, or implementing interface and buffering logic where a balance of on-chip resources and package density matters.

Backed by manufacturer documentation and a clear set of electrical and environmental ratings, this Spartan-6 LX device offers a practical option for projects that require programmable logic, moderate memory capacity and a compact package for streamlined PCB implementation.

Request a quote or submit an inquiry to receive pricing, availability and technical assistance for the XC6SLX16-3CPG196C.

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