XC6SLX16-2FTG256C

The XC6SLX16-2FTG256C is a Spartan®-6 LX field programmable gate array (FPGA) manufactured by AMD. It provides a commercial-grade, surface-mount FPGA solution in a 256‑LBGA package for embedded and programmable-logic designs.

Key on-chip resources include 14,579 logic elements, approximately 0.59 Mbits of embedded memory, and 186 user I/O. The device operates from a 1.14 V to 1.26 V core supply and supports an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• FPGA Core  Spartan®-6 LX field programmable gate array architecture from AMD for programmable digital logic integration.
• Logic Capacity  14,579 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.59 Mbits (589,824 bits) of on-chip RAM to support buffering, state storage, and small data structures.
• High I/O Count  186 user I/O pins to support multiple interfaces and signal routing on a single device.
• Power  Core voltage supply range of 1.14 V to 1.26 V for device operation.
• Package & Mounting  256‑LBGA package (supplier device package: 256‑FTBGA, 17×17) in a surface-mount form factor suitable for compact PCBs.
• Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Programmable logic and prototyping  Use the device’s 14,579 logic elements and embedded RAM for implementing and validating custom digital designs.
• I/O-rich interface bridging  186 user I/O pins make the part suitable for designs that require multiple parallel interfaces or mixed-signal IO routing.
• Embedded control  On-chip logic and RAM support control algorithms and real-time state machines in commercial electronic products operating within 0 °C to 85 °C.
• Space-constrained systems  The 256‑LBGA (17×17) surface-mount package fits compact board layouts where a high-function FPGA is required.

Unique Advantages

• Balanced logic and memory  Combines 14,579 logic elements with approximately 0.59 Mbits of embedded RAM to address both logic-heavy and memory-buffering needs.
• Generous I/O  186 user I/O pins enable integration of multiple peripherals and interfaces without external multiplexing.
• Compact package  256‑LBGA (256‑FTBGA, 17×17) reduces PCB footprint while providing robust pin density for system integration.
• Defined power envelope  A specified core supply range of 1.14 V to 1.26 V assists power budgeting and regulator selection on the board.
• Commercial operating range  Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• RoHS compliant  Environmentally compliant manufacturing meets common regulatory requirements for consumer and commercial electronics.

Why Choose XC6SLX16-2FTG256C?

The XC6SLX16-2FTG256C positions itself as a medium-capacity, commercial-grade FPGA from AMD that combines a substantial logic element count, embedded RAM, and a high I/O count in a compact 256‑LBGA package. Its defined voltage range and operating temperature make it suitable for a wide range of commercial embedded designs that require on-chip logic, interfacing, and memory resources.

This part is well suited to engineers and procurement teams building compact, I/O-dense systems or prototypes that need a programmable logic device with clear, verifiable specifications for logic capacity, memory, I/O, power, and thermal limits.

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