XC6SLX16-2FT256C

IC FPGA 186 I/O 256FTBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 14579 256-LBGA

Quantity 73 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O186Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX16-2FT256C – Spartan®-6 LX Field Programmable Gate Array, 256-LBGA

The XC6SLX16-2FT256C is a Spartan-6 LX Field Programmable Gate Array (FPGA) offered in a compact 256-LBGA package. It provides mid-density programmable logic resources, on-chip memory and a sizeable I/O complement for commercial electronic designs.

This device is intended for commercial-grade applications that require up to 14,579 logic elements, approximately 0.59 Mbits of embedded RAM, and 186 I/O in a surface-mount 256-FTBGA (17×17) package while operating within a 1.14 V to 1.26 V supply window and a 0 °C to 85 °C temperature range.

Key Features

  • Core Logic 1,139 CLBs and 14,579 logic elements (cells) deliver mid-density programmable logic capacity for a range of commercial designs.
  • Embedded Memory Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, state storage and small data structures.
  • I/O and Interfaces 186 user I/O pins support multiple parallel interfaces and board-level connectivity requirements.
  • Power Designed for a supply voltage range of 1.14 V to 1.26 V, enabling predictable integration with commercial power rails.
  • Package and Mounting 256-LBGA package (supplier package: 256-FTBGA, 17×17) with surface-mount mounting for compact PCB implementations.
  • Operating Range Commercial temperature range of 0 °C to 85 °C suitable for typical commercial electronics environments.
  • Environmental Compliance RoHS compliant for conformity with common lead-free manufacturing requirements.

Typical Applications

  • Commercial Embedded Systems — Mid-density programmable logic for control, glue logic and custom processing in commercial products.
  • Prototyping and Development — Functional evaluation and proof-of-concept work where up to 14,579 logic elements and on-chip RAM are required.
  • I/O-Intensive Designs — Interface bridging and I/O expansion tasks that benefit from 186 available user I/O pins.
  • Compact Board-Level Solutions — Surface-mount 256-LBGA (17×17 FTBGA) package for space-constrained commercial PCBs.

Unique Advantages

  • Mid-density programmable logic: 14,579 logic elements provide a balance of capacity and efficiency for many commercial applications.
  • Integrated on-chip memory: Approximately 0.59 Mbits of embedded RAM reduces external memory needs for buffering and small data storage.
  • Generous I/O count: 186 I/O pins simplify integration of multiple interfaces without extensive external logic.
  • Compact, board-friendly package: 256-LBGA / 256-FTBGA (17×17) surface-mount footprint supports dense PCB layouts.
  • Commercial temperature and supply compatibility: Operates across 0 °C to 85 °C with a 1.14 V to 1.26 V supply range for standard commercial power and thermal envelopes.
  • RoHS compliant: Meets lead-free manufacturing requirements for commercial production.

Why Choose XC6SLX16-2FT256C?

The XC6SLX16-2FT256C combines a mid-density logic fabric of 14,579 logic elements with approximately 0.59 Mbits of embedded RAM and 186 I/O in a compact 256-LBGA surface-mount package. Its commercial-grade temperature range and defined supply window make it suitable for a broad set of commercial electronic designs that require flexible programmable logic, onboard memory and substantial I/O in a small form factor.

This device is well suited to design teams and procurement professionals specifying FPGAs for commercial applications where the presented mix of logic capacity, memory and I/O directly aligns with project requirements.

Request a quote for the XC6SLX16-2FT256C to check pricing and availability for your next commercial FPGA design.

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