XC6SLX16-2CSG324C

IC FPGA 232 I/O 324CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 232 589824 14579 324-LFBGA, CSPBGA

Quantity 412 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LFBGA, CSPBGANumber of I/O232Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX16-2CSG324C – Spartan®-6 LX FPGA (324-LFBGA)

The XC6SLX16-2CSG324C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 324-pin LFBGA package. It delivers a reconfigurable hardware platform with approximately 14,579 logic elements, embedded memory, and a substantial I/O complement for commercial embedded designs.

Designed for commercial-grade applications, this device combines on-chip resources and low-voltage operation to support a range of configurable digital logic tasks while meeting RoHS compliance.

Key Features

  • Logic Capacity  Approximately 14,579 logic elements for implementing custom digital logic and finite-state systems.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM to support buffering, small FIFOs, and local storage for logic functions.
  • I/O Count  232 general-purpose I/O pins to support dense peripheral interfacing and multi-channel signal routing.
  • Power  Core supply range of 1.14 V to 1.26 V to match system power-rail requirements and enable low-voltage designs.
  • Package & Mounting  324-LFBGA (324-CSPBGA, 15×15) in a surface-mount package for compact board-level integration.
  • Operating Conditions  Commercial-grade temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment in commercial products.

Typical Applications

  • Commercial Embedded Systems  Use as configurable logic and I/O control in commercial embedded products where reprogrammability and a compact package are required.
  • Prototyping & Development  Deploy for hardware prototyping and iterative design cycles that benefit from reconfigurable logic capacity and embedded RAM.
  • Custom I/O Interfaces  Implement protocol bridging, custom signal conditioning, or multi-channel I/O aggregation leveraging the device's 232 I/O pins.

Unique Advantages

  • Balanced Integration: Combines a significant logic element count with embedded memory and a high I/O count to reduce external components.
  • Compact Package: The 324-LFBGA (15×15) surface-mount package enables dense PCB layouts and space-efficient system designs.
  • Low-Voltage Core: Core supply between 1.14 V and 1.26 V supports modern low-voltage power architectures.
  • Commercial-Rated Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for broad commercial deployment.
  • Reconfigurability: Field-programmable architecture allows design updates and functional iterations without hardware redesign.

Why Choose XC6SLX16-2CSG324C?

The XC6SLX16-2CSG324C positions itself as a practical, reconfigurable building block for commercial embedded designs that need a balanced mix of logic, embedded memory, and I/O density in a compact surface-mount package. Its voltage range, operating temperature, and RoHS compliance make it suitable for a wide range of commercial product designs where board space and flexibility matter.

Customers designing configurable logic, interface bridging, or prototype systems will find the device's combination of approximately 14,579 logic elements, roughly 0.59 Mbits of on-chip RAM, and 232 I/O pins useful for reducing BOM complexity and accelerating development cycles.

Request a quote or contact our sales team to discuss availability and pricing for the XC6SLX16-2CSG324C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up