XC6SLX16-2CS324I4204

IC FPGA 232 I/O 324CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 232 589824 14579 324-LFBGA, CSPBGA

Quantity 500 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O232Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX16-2CS324I4204 – Spartan®-6 LX FPGA in 324-CSPBGA

The XC6SLX16-2CS324I4204 is an AMD Spartan®-6 LX field programmable gate array (FPGA) supplied in a 324-pin CSPBGA 15×15 package. It is offered in an industrial grade variant with surface-mount packaging and an extended operating temperature range.

Key on-chip resources include 14,579 logic elements, approximately 0.59 Mbits of embedded memory (589,824 bits), and 232 user I/O pins. The device operates from a core supply range of 1.14 V to 1.26 V and is specified for −40 °C to 100 °C operation.

Key Features

  • Core Logic 14,579 logic elements provide mid-range programmable logic capacity for consolidating multiple functions on a single device.
  • Configurable Logic Blocks (CLBs) 1,139 CLBs available for implementing combinational and sequential logic structures.
  • Embedded Memory Approximately 0.59 Mbits (589,824 bits) of on-chip RAM to support buffering, state storage, and local data processing.
  • I/O Count 232 general-purpose I/O pins enable extensive peripheral interfacing and system connectivity.
  • Power Core supply voltage range of 1.14 V to 1.26 V for compatibility with low-voltage FPGA power architectures.
  • Package & Mounting 324-CSPBGA (15×15) package in a 324-LFBGA footprint, designed for surface-mount PCB assembly and high-density board layouts.
  • Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High integration density: 14,579 logic elements and on-chip RAM allow consolidation of multiple functions, reducing external components.
  • Significant I/O capacity: 232 I/O pins support complex interface requirements without adding external expansion.
  • Industrial temperature capability: Rated for −40 °C to 100 °C to maintain operation in extended temperature environments.
  • Compact, surface-mount packaging: 324-CSPBGA (15×15) package enables space-efficient PCB designs and high component density.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system power rails.
  • Regulatory compliance: RoHS status supports environmentally constrained designs and procurement requirements.

Why Choose XC6SLX16-2CS324I4204?

The XC6SLX16-2CS324I4204 delivers a balanced combination of logic capacity, on-chip memory, and I/O resources in a compact 324-CSPBGA package, making it suitable for mid-range FPGA designs that require industrial temperature performance. Its specified core voltage range and RoHS compliance provide practical integration points for contemporary embedded systems.

This device is a fit for development and production environments that need a reliable, mid-density FPGA solution from AMD with clearly defined electrical, thermal, and packaging characteristics.

Request a quote or submit a pricing inquiry to receive availability and purchasing details for the XC6SLX16-2CS324I4204.

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