XC6SLX16-2CSG324CES

The XC6SLX16-2CSG324CES is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD supplied in a 324-LFBGA (15×15) CSPBGA package. It delivers programmable logic resources, on-chip memory, and a high count of I/Os for compact, surface-mount applications.

With 14,579 logic elements, approximately 0.59 Mbits of embedded memory, and 232 I/O pins, this commercial-grade device is suited to designs that require medium-density programmable logic with defined power and temperature operating limits.

Key Features

• Core Logic: 14,579 logic elements provide the device's programmable fabric for implementing custom digital logic functions.
• Logic Blocks: 1,139 logic blocks (as specified) to structure combinational and sequential resources across the device.
• Embedded Memory: Approximately 0.59 Mbits of on-chip RAM for data buffering, FIFOs, and small memory structures close to logic.
• I/O Capacity: 232 I/O pins to support multiple parallel interfaces, peripherals, and board-level connectivity.
• Power Supply: Core voltage range of 1.14 V to 1.26 V for defined power domain planning and regulator selection.
• Package & Mounting: 324-LFBGA (324-CSPBGA, 15×15) surface-mount package for high-density PCB layouts and compact system integration.
• Operating Range: Commercial-grade operating temperature from 0 °C to 85 °C and RoHS-compliant construction for regulatory alignment.

Typical Applications

• Embedded Control and Logic: Implement custom control algorithms and glue logic using the device's 14,579 logic elements and on-chip RAM for local data storage.
• Interface Bridging: Use the 232 I/Os to aggregate and translate multiple peripheral interfaces in compact, board-level designs.
• Prototyping and Development: Medium-density FPGA resources make it suitable for proof-of-concept systems and iterative hardware development.

Unique Advantages

• Balanced Logic and Memory: Combines 14,579 logic elements with approximately 0.59 Mbits of embedded RAM to support both control logic and local buffering without external memory for many use cases.
• High I/O Density: 232 I/Os allow flexible partitioning of signals and support for concurrent interfaces, reducing the need for external multiplexing.
• Compact Surface-Mount Package: The 324-LFBGA (15×15) CSPBGA package enables a small PCB footprint for space-constrained applications.
• Defined Power Envelope: A specified core supply range of 1.14 V to 1.26 V simplifies power-supply selection and integration into regulated systems.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical consumer and commercial deployment environments.
• RoHS Compliant: Environmentally compliant construction for assembly and regulatory needs.

Why Choose XC6SLX16-2CSG324CES?

The XC6SLX16-2CSG324CES positions as a medium-density Spartan®-6 LX FPGA offering a practical balance of logic elements, embedded memory, and I/O count in a compact 324-LFBGA package. Its electrical and thermal specifications support reliable integration into commercial applications that require programmable logic, interface consolidation, or development platforms.

Designed and manufactured by AMD, this device provides a stable choice for teams that need a defined resource set—logic, RAM, and I/O—backed by a recognized FPGA family. Its package and RoHS compliance help streamline assembly and environmental conformity for volume production.

Request a quote or submit a purchase inquiry to learn current availability and lead time for the XC6SLX16-2CSG324CES. Our team can provide pricing, volume options, and delivery details to support your design and procurement planning.