XC6SLX16-2FT256I

IC FPGA 186 I/O 256FTBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 14579 256-LBGA

Quantity 943 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O186Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX16-2FT256I – Spartan®-6 LX FPGA, 256‑LBGA, Industrial

The XC6SLX16-2FT256I is a Spartan®-6 LX field programmable gate array (FPGA) device offered in a 256-pin LBGA package for surface-mount applications. It provides a balance of programmable logic resources, embedded memory, and a broad I/O count suitable for industrial embedded designs that require reconfigurable hardware.

Key device attributes include 14,579 logic elements, approximately 0.59 Mbits of on-chip RAM, 186 user I/Os, and an industrial operating temperature range, delivering a verifiable platform for compact, temperature-tolerant FPGA implementations.

Key Features

  • Core Logic  14,579 logic elements provide the device's programmable logic capacity for implementing customized digital functions.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for data buffering, state storage, and small embedded memory requirements.
  • I/O Resources  186 user I/Os support diverse peripheral and interface connections in a compact package footprint.
  • Power Supply  Nominal core voltage range from 1.14 V to 1.26 V for the device core supply.
  • Package & Mounting  Supplier device package: 256-FTBGA (17×17); package case 256-LBGA; designed for surface-mount assembly.
  • Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Regulatory Compliance  RoHS compliant for environmental compliance in manufacturing and distribution.

Unique Advantages

  • Verified Logic Capacity: 14,579 logic elements enable a wide range of custom digital implementations while keeping the component count low.
  • On‑chip Memory for Embedded Tasks: Approximately 0.59 Mbits of RAM supports local buffering and state retention without external memory integration.
  • High I/O Count in Compact Package: 186 user I/Os in a 256‑pin LBGA (256‑FTBGA) package help maximize connectivity in space-constrained designs.
  • Industrial Temperature Support: Rated for −40 °C to 100 °C operation, enabling use in industrial and other temperature-challenging systems.
  • Surface-Mount Compatibility: The 256‑LBGA surface-mount form factor fits standard PCB assembly workflows and compact board layouts.
  • RoHS Compliant: Conforms to RoHS requirements for environmentally conscious manufacturing.

Why Choose XC6SLX16-2FT256I?

The XC6SLX16-2FT256I offers a practical combination of programmable logic, embedded memory, and I/O density in a compact surface-mount LBGA package, tailored for industrial-grade applications requiring temperature tolerance and reconfigurable hardware. Its verified specifications make it suitable for engineers seeking a clearly defined FPGA building block that integrates into constrained board spaces.

With a defined core voltage range and RoHS compliance, this device is positioned for designs where predictable electrical and environmental characteristics matter. It is appropriate for development teams and procurement groups targeting reliable FPGA capacity with clear, verifiable specifications.

Request a quote or submit your part requirement to receive pricing and availability information for the XC6SLX16-2FT256I. Our team can assist with order placement and supply details.

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