XC6SLX16-3CSG324I

The XC6SLX16-3CSG324I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD. It provides a combination of configurable logic, embedded RAM, and a substantial I/O count in a surface-mount 324‑LFBGA (15×15) CSPBGA package for industrial-grade designs.

With 14,579 logic elements, approximately 0.59 Mbits of embedded memory, and support for a 1.14 V to 1.26 V core supply, this device targets applications that require moderate programmable logic capacity, on-chip memory, and robust operating temperature capability.

Key Features

• Logic Capacity  14,579 logic elements provide programmable logic resources for custom logic implementation and control functions.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) for data buffering, FIFOs, and small on-chip storage.
• I/O Resources  232 I/O pins to support multiple interfaces, sensors, and peripheral connections in a single device.
• Core Voltage  Specified core voltage range of 1.14 V to 1.26 V to match system power-rail design requirements.
• Package & Mounting  324‑LFBGA (CSPBGA) 15×15 package in a surface-mount form factor for compact board-level integration.
• Industrial Grade & Temperature  Rated for industrial operation from −40 °C to 100 °C to meet harsher environmental conditions.
• Regulatory  RoHS-compliant construction for environmental compliance in applicable designs.

Typical Applications

• Industrial Control  Integration into control systems that require an industrial temperature range and flexible I/O for sensor and actuator interfacing.
• Embedded Logic & Glue  Use as a programmable logic hub to implement custom glue logic, protocol bridging, or timing control leveraging its logic elements and I/O count.
• Data Buffering & Processing  On-chip RAM supports buffering and small-scale data handling tasks within embedded processing pipelines.
• Compact, Board-Level Designs  The 15×15 324‑LFBGA package enables high-density mounting for space-constrained applications while maintaining a high I/O count.

Unique Advantages

• Industrial temperature capability: Rated −40 °C to 100 °C for reliable operation in demanding environments.
• Substantial logic resources: 14,579 logic elements allow implementation of mid-size FPGA designs without external logic components.
• Generous on-chip memory: Approximately 0.59 Mbits of embedded RAM for local buffering and state storage, reducing external memory needs.
• High I/O count in a compact package: 232 I/O pins in a 324‑LFBGA (15×15) CSPBGA package support multiple interfaces while minimizing board area.
• Defined core voltage window: 1.14 V to 1.26 V supply specification simplifies power-rail planning and integration.
• RoHS compliance: Environmentally compliant manufacturing for projects requiring RoHS adherence.

Why Choose XC6SLX16-3CSG324I?

The XC6SLX16-3CSG324I delivers a balanced combination of logic capacity, embedded memory, and I/O in an industrial-grade Spartan®-6 LX FPGA package from AMD. Its specification set—including 14,579 logic elements, approximately 0.59 Mbits of RAM, 232 I/O, and a −40 °C to 100 °C operating range—makes it well suited for industrial and embedded designs that require reliable programmable logic and compact board-level integration.

Choose this FPGA when your design needs moderate programmable logic and on-chip memory with a high I/O count and industrial temperature capability, backed by AMD’s Spartan-6 family architecture and RoHS-compliant construction.

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