XC6SLX16-3FTG256I

The XC6SLX16-3FTG256I is a Spartan®-6 LX field programmable gate array (FPGA) IC offered in a 256-LBGA package. It provides a compact, surface-mount FPGA option with a balance of logic resources, embedded memory, and I/O capacity suitable for industrial applications.

With 14,579 logic elements, approximately 0.59 Mbits of embedded memory, and 186 user I/O pins, this device targets designs that require moderate digital integration in a 256-FTBGA (17×17) footprint while operating over an industrial temperature range.

Key Features

• Logic Capacity  Provides 14,579 logic elements to implement custom digital functions and finite-state logic within a mid-range FPGA fabric.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (589,824 total RAM bits) for buffering, small data storage, and state retention without external memory.
• I/O Resources  186 user I/O pins enable broad interfacing to peripherals, sensors, and external logic in constrained board layouts.
• Power Supply  Operates from a defined core supply range of 1.14 V to 1.26 V for predictable power planning and design integration.
• Package & Mounting  256-LBGA package, supplied as 256-FTBGA (17×17), in a surface-mount form factor suitable for automated PCB assembly.
• Operating Range  Industrial temperature operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Regulatory  RoHS compliant, meeting common material and lead-free requirements for modern electronic assemblies.

Typical Applications

• Industrial Control  Leverage the −40 °C to 100 °C operating range and 186 I/O pins for motor control, sensor interfacing, and factory automation logic.
• Embedded System Integration  Use the 14,579 logic elements and approximately 0.59 Mbits of embedded memory to implement glue logic, protocol bridging, and custom peripheral control.
• Compact Board Designs  The 256-LBGA (256-FTBGA, 17×17) surface-mount package enables dense layouts where board space and automated assembly are priorities.

Unique Advantages

• Balanced Logic and Memory: 14,579 logic elements paired with ~0.59 Mbits of on-chip RAM provide capacity for mid-complexity designs without immediate need for external memory.
• High I/O Count: 186 user I/O pins support diverse peripheral connections and flexible board-level partitioning.
• Industrial Temperature Support: Rated for −40 °C to 100 °C operation, enabling deployments in harsher ambient conditions.
• Compact, Assembly-Ready Package: 256-FTBGA (17×17) in a surface-mount LBGA footprint simplifies PCB integration and automated manufacturing.
• Predictable Power Window: A defined core supply range (1.14–1.26 V) aids power-supply design and thermal planning.
• RoHS Compliance: Material compliance supports regulatory requirements for modern electronics production.

Why Choose XC6SLX16-3FTG256I?

The XC6SLX16-3FTG256I positions itself as a practical FPGA choice for engineers seeking mid-range programmable logic with a compact BGA footprint and industrial temperature capability. Its combination of 14,579 logic elements, approximately 0.59 Mbits of embedded RAM, and 186 I/Os makes it well suited for embedded control, interface bridging, and other applications where on-chip resources and robust environmental performance matter.

This device offers designers a predictable power envelope and surface-mount packaging compatible with modern assembly processes, while RoHS compliance supports material and regulatory needs. It is appropriate for teams designing industrial and embedded systems that require scalable logic capacity and reliable operation across a wide temperature range.

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