XC6SLX16-3FT256C

The XC6SLX16-3FT256C is a Spartan®-6 LX field programmable gate array supplied in a 256‑ball LBGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O density for commercial electronic designs.

As a commercial‑grade FPGA, this device is suitable for applications that require on‑board programmable logic, flexible I/O interfacing, and a compact surface‑mount package while operating within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  14,579 logic elements and 1,139 configurable logic blocks provide substantial programmable logic resources for custom digital designs.
• Embedded Memory  Approximately 0.59 Mbits of on‑chip RAM (589,824 total bits) to support buffering, storage for state machines, and small data structures.
• I/O  186 user I/O pins for flexible interfacing with peripherals, sensors, and external components.
• Package & Mounting  256‑LBGA package (supplier device package: 256‑FTBGA, 17×17) in a surface‑mount form factor to minimize board footprint.
• Power  Defined core supply range of 1.14 V to 1.26 V to match system power delivery requirements.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for general commercial electronics environments.
• Compliance  RoHS compliant, supporting lead‑free assembly and regulatory requirements for many commercial products.

Typical Applications

• Commercial Embedded Systems  Programmable logic and on‑chip memory enable custom control and processing functions in compact embedded products.
• Interface Bridging  With 186 I/Os, the device can consolidate multiple peripheral interfaces and translate between logic domains on a single chip.
• Prototyping and Development  Sufficient logic capacity and memory make it suitable for evaluating custom digital architectures and proof‑of‑concept designs.
• Custom I/O Control  Use the available I/O and programmable logic to implement specialized user interfaces, signal conditioning, or protocol handling.

Unique Advantages

• Substantial Programmable Logic:  14,579 logic elements give designers room to implement complex logic without external ASICs or discrete glue logic.
• Embedded Memory On‑Chip:  Approximately 0.59 Mbits of RAM reduces dependence on external memory for small buffers and state storage.
• High I/O Count:  186 I/Os simplify board routing by consolidating multiple signals through a single FPGA package.
• Compact BGA Package:  256‑LBGA (256‑FTBGA, 17×17) saves PCB area and supports surface‑mount assembly processes.
• Commercial Temperature Range:  0 °C to 85 °C rating aligns with many commercial product requirements without over‑specifying for industrial or automotive use.
• RoHS Compliant:  Supports lead‑free manufacturing requirements for commercial electronic products.

Why Choose XC6SLX16-3FT256C?

The XC6SLX16-3FT256C offers a blend of programmable logic, embedded memory, and a high‑density I/O set in a compact BGA package tailored for commercial electronic designs. Its defined core voltage range and temperature rating make it straightforward to integrate into systems with established power and thermal profiles.

This part is well suited for designers and teams seeking a commercially graded FPGA solution that provides scalability in logic and memory resources, simplified board integration through a 256‑ball LBGA package, and RoHS compliance for modern manufacturing processes.

Request a quote or submit an inquiry to get pricing and availability for the XC6SLX16-3FT256C and to discuss how it can fit your next commercial FPGA design.