XC6SLX16-3FT256I

IC FPGA 186 I/O 256FTBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 14579 256-LBGA

Quantity 1,219 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O186Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1139Number of Logic Elements/Cells14579
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of XC6SLX16-3FT256I – Spartan®-6 LX FPGA, 256-LBGA

The XC6SLX16-3FT256I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC offered in a 256-LBGA package. The device provides 14,579 logic elements and approximately 0.59 Mbits of embedded memory (589,824 total RAM bits), together with 186 I/O pins, making it a compact, programmable logic solution for embedded designs.

Built for surface-mount assembly, this industrial-grade FPGA operates from a supply voltage range of 1.14 V to 1.26 V and across an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant and is supplied in a 256-FTBGA (17×17) package format.

Key Features

  • Core Logic 14,579 logic elements provide programmable digital resources for implementing custom logic and state machines.
  • Embedded Memory Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for local buffering, lookup tables, and state storage.
  • I/O Capacity 186 available I/O pins to support a range of external interfaces and peripheral connections.
  • Power Low-voltage operation with a specified supply range of 1.14 V to 1.26 V for integration into modern low-voltage systems.
  • Package & Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) designed for surface-mount PCB assembly in space-constrained layouts.
  • Temperature & Grade Industrial grade device with an operating temperature range from −40 °C to 100 °C for use in demanding environments.
  • Regulatory Compliance RoHS compliant to support environmental and regulatory requirements.

Unique Advantages

  • High programmable density: 14,579 logic elements enable consolidation of multiple logic functions into a single device, simplifying board-level design.
  • Integrated on-chip memory: Approximately 0.59 Mbits of embedded RAM provides local storage for buffering and state retention without external memory.
  • Generous I/O count: 186 I/O pins support extensive peripheral connectivity and flexible interface routing.
  • Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation in temperature-demanding applications.
  • Compact surface-mount package: 256-LBGA / 256-FTBGA (17×17) package allows dense PCB integration while maintaining robust pinout.
  • Low-voltage system compatibility: 1.14 V to 1.26 V supply range facilitates integration with low-voltage power domains.

Why Choose XC6SLX16-3FT256I?

The XC6SLX16-3FT256I positions itself as a versatile, industrial-grade Spartan®-6 LX FPGA that combines a substantial logic element count, embedded memory, and a high I/O count within a compact 256-LBGA surface-mount package. Its specified operating temperature range and RoHS compliance make it suitable for projects that require durability and regulatory alignment.

This device is suited for design teams and procurement departments seeking a programmable hardware option that balances logic capacity, on-chip memory, and flexible I/O in a low-voltage, surface-mount form factor, supported by documented package and supply specifications.

Request a quote or submit an RFQ to receive pricing and availability information for the XC6SLX16-3FT256I.

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