XC6SLX16-3FTG256C

The XC6SLX16-3FTG256C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD designed for commercial embedded logic applications. It integrates 14,579 logic elements and approximately 0.59 Mbits of on-chip RAM in a compact 256-LBGA package, providing a balance of logic density and embedded memory for mid-range programmable designs.

Key device characteristics include 186 user I/O pins, a supply voltage range of 1.14 V to 1.26 V, surface-mount packaging, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  14,579 logic elements provide the programmable fabric needed for custom digital functions and mid-range logic integration.
• Embedded Memory  Approximately 0.59 Mbits of total on-chip RAM for buffering, FIFOs, and small data stores within the FPGA fabric.
• I/O  186 user I/O pins support connectivity to peripherals, interfaces, and external devices in a single-package solution.
• Power and Voltage  Operates from a core supply range of 1.14 V to 1.26 V, enabling predictable power design for the FPGA core.
• Package  256-LBGA package; supplier device package listed as 256-FTBGA (17×17), suitable for surface-mount assembly.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant, supporting environmentally conscious designs.

Unique Advantages

• Right-sized logic for mid-range designs: 14,579 logic elements offer a practical balance of capacity without the overhead of larger devices.
• On-chip memory for system integration: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for small buffers and control structures.
• Generous I/O count: 186 I/O pins enable direct interfacing to multiple peripherals and I/O buses from a single package.
• Compact BGA package: 256-LBGA / 256-FTBGA (17×17) conserves PCB area while supporting surface-mount assembly processes.
• Predictable power design: A defined core voltage window (1.14 V–1.26 V) simplifies power-supply selection and decoupling strategies.
• Commercial temperature and RoHS compliance: Suitable for general-purpose commercial applications with environmental compliance tracked.

Why Choose XC6SLX16-3FTG256C?

The XC6SLX16-3FTG256C positions itself as a versatile Spartan-6 LX FPGA option for engineers seeking balanced logic density, embedded RAM, and a substantial I/O count in a compact BGA package. Its commercial-grade temperature range and RoHS compliance make it appropriate for a wide range of general-purpose embedded systems.

This device is a practical choice for teams that require mid-range programmable logic capacity with on-chip memory and flexible connectivity, while maintaining a compact board footprint and defined supply-voltage requirements.

Request a quote to check availability and pricing for the XC6SLX16-3FTG256C or submit a quote request to get further procurement details.