XC6SLX150T-N3FGG676I

The XC6SLX150T-N3FGG676I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) provided in a 676-ball BGA package. It delivers a large pool of programmable logic and system I/O intended for industrial applications that require configurable digital logic, embedded memory, and flexible I/O density.

Key attributes include 147,443 logic elements, approximately 4.94 Mbits of embedded RAM, and 396 I/O pins, with an operating range suited for industrial temperature environments and a defined core voltage supply range.

Key Features

• Core Logic 147,443 logic elements provide substantial resources for implementing complex programmable logic and custom datapaths.
• Configurable Logic Blocks (CLBs) 11,519 CLBs (as listed) structure the device’s logic fabric for efficient logic synthesis and mapping.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Capacity 396 user I/O pins to accommodate broad peripheral interfacing and multi-channel connectivity in dense system designs.
• Package and Mounting 676-ball FBGA package (27 × 27 mm) in a surface-mount format for compact board-level integration and high pin-count routing.
• Power Core voltage supply specified at 1.14 V to 1.26 V, enabling defined power planning for the programmable core.
• Temperature Range Specified operating temperature from −40 °C to 100 °C suitable for industrial temperature environments.
• Compliance RoHS compliant, supporting environmental and assembly considerations.

Typical Applications

• Industrial Control & Automation — Use the FPGA’s logic capacity and I/O density for motor control, PLC functions, and protocol bridging in industrial systems operating across wide temperatures.
• Communications Infrastructure — Implement custom packet processing, protocol adaptation, or framing logic using the device’s large logic fabric and embedded memory.
• Test & Measurement Equipment — Leverage on-chip RAM and abundant I/O for data capture, signal conditioning logic, and real-time processing tasks.

Unique Advantages

• Substantial Logic Capacity: 147,443 logic elements enable complex logic implementations and integration of multiple functions on a single device, reducing system BOM.
• Generous Embedded Memory: Approximately 4.94 Mbits of RAM supports buffering and local data storage, minimizing dependence on external memory in many designs.
• High I/O Count: 396 I/O pins provide flexibility for interfacing with sensors, peripherals, or multi-channel I/O requirements.
• Industrial Temperature Support: −40 °C to 100 °C operating range allows deployment in thermally demanding industrial environments.
• Compact High-Pin Package: 676-FBGA (27 × 27 mm) delivers high pin density in a surface-mount form factor for space-constrained PCBs.
• Defined Core Power Envelope: 1.14 V to 1.26 V supply range helps simplify power-supply design and thermal planning for the FPGA core.

Why Choose XC6SLX150T-N3FGG676I?

The XC6SLX150T-N3FGG676I balances ample programmable logic, significant on-chip memory, and high I/O count in a single industrial-grade FPGA package. Its combination of 147,443 logic elements, approximately 4.94 Mbits of embedded RAM, and 396 I/Os makes it well suited for engineers building robust, integrated systems that require configurable logic and reliable operation across industrial temperature ranges.

Choose this part when your design calls for scalable logic capacity, substantial local memory, and a high-density package for compact boards—providing long-term value through integration and a clearly specified electrical and thermal operating window.

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