XC6SLX150T-4FGG900C

The XC6SLX150T-4FGG900C is a Spartan®-6 LXT field programmable gate array (FPGA) provided in a 900-BBGA package. It delivers a large programmable fabric with on-chip memory and a substantial number of I/O pins, suitable for designs that require high logic capacity and flexible I/O integration.

As a commercial-grade surface-mount FPGA, it supports a core voltage range of 1.14 V to 1.26 V and operates across a 0 °C to 85 °C temperature range, with RoHS compliance for environmental conformity.

Key Features

• Core Logic  11,519 configurable logic blocks (CLBs) and approximately 147,443 logic elements for implementing complex digital functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, state storage, and temporary data processing.
• I/O Capacity  540 I/O pins to support wide parallel interfaces, multiple peripheral connections, and board-level routing flexibility.
• Power  Core supply voltage specified from 1.14 V to 1.26 V to match target system power rails.
• Package & Mounting  900-ball BGA package (supplier package: 900-FBGA, 31×31) in a surface-mount form factor for compact PCB integration.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for reduced hazardous substances.

Typical Applications

• Embedded systems  Use the FPGA for implementing customizable digital logic and control functions where on-chip memory and large logic capacity are needed.
• I/O-intensive designs  Ideal for applications that require many external interfaces or parallel connections, leveraging the 540 available I/Os.
• Buffering and data processing  Systems that benefit from on-chip RAM—approximately 4.94 Mbits—can use the device for local buffering and temporary data storage.

Unique Advantages

• High logic capacity: 147,443 logic elements and 11,519 CLBs provide the resources to implement substantial custom digital logic blocks on a single device.
• Significant on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for many buffering and stateful functions.
• Extensive I/O availability: 540 I/Os simplify board-level design by accommodating multiple peripherals and wide data buses without additional I/O expansion.
• Compact BGA footprint: 900-BBGA (900-FBGA, 31×31) package enables dense PCB layouts while maintaining a large logic and I/O count.
• Commercial-grade operation: Specified for 0 °C to 85 °C, suitable for standard commercial environments with RoHS compliance for environmental requirements.
• Surface-mount integration: Designed for standard SMT assembly processes to streamline manufacturing and board assembly.

Why Choose XC6SLX150T-4FGG900C?

The XC6SLX150T-4FGG900C positions itself as a high-capacity Spartan®-6 LXT FPGA for designs that need extensive programmable logic, on-chip memory, and a large number of I/Os in a compact BGA package. Its combination of CLBs, logic elements, and embedded RAM supports complex digital implementations while the 900-BBGA package helps keep PCB area optimized.

This device is well suited to designers and procurement teams targeting commercial applications that require scalable programmable logic, significant local memory, and broad I/O connectivity, all delivered in a RoHS-compliant, surface-mount form factor.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XC6SLX150T-4FGG900C. Our team can assist with lead times and volume requirements.