XC6SLX150T-4FGG484C

The XC6SLX150T-4FGG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD supplied in a 484-BBGA package. It delivers a large logic resource set and on-chip memory suitable for complex, configurable digital designs.

This commercial-grade, surface-mount FPGA features extensive I/O, a defined core voltage range, and RoHS compliance, offering a pragmatic platform for designers who need substantial logic and embedded memory in a compact package.

Key Features

• Logic Capacity — 147,443 logic elements provide a substantial amount of programmable logic for implementing complex digital functions.
• Configurable Logic Blocks (CLBs) — 11,519 CLBs for structured placement of logic resources and design partitioning.
• Embedded Memory — Approximately 4.94 Mbits of total on-chip RAM bits (4,939,776 bits) to support buffering, state storage, and lookup tables.
• I/O Count — 296 I/O pins to support a wide range of external interfaces and peripherals.
• Power Supply — Core voltage supply range of 1.14 V to 1.26 V for defined power-domain design and supply planning.
• Package & Mounting — 484-BBGA package; supplier device package indicated as 484-FBGA (23×23). Surface-mount mounting type for PCB assembly.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-density digital processing — Implement custom logic, data-paths, and control functions using the large pool of logic elements and CLBs.
• Embedded buffering and memory functions — Utilize approximately 4.94 Mbits of on-chip RAM for buffering, FIFOs, and lookup tables in data handling applications.
• Multi-interface systems — Support systems requiring many external connections with 296 I/O pins for sensors, peripherals, or interface bridging.

Unique Advantages

• Substantial logic resources — 147,443 logic elements enable implementation of sizeable or multiple concurrent logic functions on a single device.
• Integrated embedded memory — Nearly 5 Mbits of on-chip RAM reduces dependence on external memory for many typical buffering and state-storage needs.
• Ample I/O availability — 296 I/O pins simplify board-level integration with multiple peripherals and interfaces without external multiplexing.
• Compact BGA package — 484-ball BGA footprint balances board area and pin density for high-density PCB designs.
• Defined power envelope — Clear core voltage specification (1.14 V–1.26 V) assists in power-supply design and system integration.
• Commercial temperature suitability — Rated for 0 °C to 85 °C, appropriate for commercial product environments and standard electronics applications.

Why Choose XC6SLX150T-4FGG484C?

The XC6SLX150T-4FGG484C positions itself as a high-capacity, commercially graded FPGA that pairs a large logic fabric with significant on-chip memory and generous I/O. Its combination of 147,443 logic elements, approximately 4.94 Mbits of RAM, and 296 I/O pins makes it a practical choice for designers building complex, configurable digital systems within the 0 °C to 85 °C operating window.

Backed by AMD manufacturing and RoHS compliance, this device is suited for development teams and procurement groups seeking a scalable, compact FPGA solution in a 484-BBGA/484-FBGA (23×23) form factor.

Request a quote or contact our sales team to check availability and pricing for the XC6SLX150T-4FGG484C and to discuss how it can fit into your next design.