XC6SLX150T-3FGG676I

The XC6SLX150T-3FGG676I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD offering high logic capacity and substantial embedded memory in a compact BGA package. It targets applications requiring dense programmable logic, a large number of I/O, and operation across industrial temperature ranges.

Key attributes include 11,519 CLBs (147,443 logic elements), approximately 4.94 Mbits of embedded memory, 396 I/O, a 676-ball FBGA package (27×27), and industrial-grade temperature and RoHS compliance.

Key Features

• Logic Capacity — 11,519 CLBs providing a total of 147,443 logic elements for complex programmable logic implementations.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density — 396 I/O pins to accommodate multiple interfaces and parallel connectivity in a single device.
• Power Supply — Operates from a core supply range of 1.14 V to 1.26 V, enabling defined power budgeting in system design.
• Package & Mounting — 676-FBGA (27×27) package in a 676-BGA footprint with surface-mount construction for compact board-level integration.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C for use in demanding environments.
• Environmental Compliance — RoHS compliant to meet regulatory requirements for hazardous substance reduction.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of large, performance-oriented designs without external logic expansion.
• Significant on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• Extensive I/O capability: 396 I/O pins support multiple interfaces and parallel signals, simplifying system-level integration.
• Industrial robustness: Rated for −40 °C to 100 °C and specified as industrial grade, suitable for deployment in harsh or temperature-variable environments.
• Compact, assembly-friendly package: 676-FBGA (27×27) surface-mount package balances board-space efficiency with high pin count for dense designs.

Why Choose XC6SLX150T-3FGG676I?

The XC6SLX150T-3FGG676I combines a high number of CLBs and logic elements with substantial embedded memory and broad I/O capability, offering a balanced solution for designs that demand on-chip resources and flexible interfacing. Its industrial temperature rating and RoHS compliance make it appropriate for applications that require reliable operation across a wide thermal range while meeting environmental requirements.

Backed by AMD, this Spartan®-6 LXT device is suited to engineers and procurement teams seeking a robust, high-density FPGA in a compact 676-BGA package for industrial and embedded systems where on-chip capacity and I/O density are priorities.

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