XC6SLX150T-3FGG900I

The XC6SLX150T-3FGG900I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, supplied in a 900-BBGA package. It provides high logic density and on-chip memory while supporting a wide I/O count and industrial temperature operation, making it suitable for complex, space-constrained digital designs.

Key Features

• Core Architecture Spartan-6 LXT FPGA architecture from AMD in a 900-BBGA package.
• Logic Capacity 11,519 configurable logic blocks (CLBs) delivering 147,443 logic elements for implementing large, parallelizable logic functions.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Resources 540 I/O pins to interface with external peripherals, sensors, and high-density connectors.
• Power Core supply voltage range of 1.14 V to 1.26 V to match system power rails and thermal budgets.
• Package & Mounting 900-BBGA package (supplier device package: 900-FBGA, 31×31 mm) in a surface-mount form factor for compact PCB layouts.
• Temperature Range Rated for operation from −40 °C to 100 °C for industrial thermal environments.
• Compliance RoHS compliant.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of complex algorithms and large state machines without external ASICs.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces the need for external memory in many buffering and data-processing tasks.
• Extensive I/O capability: 540 I/Os support broad interfacing options for high-channel-count or mixed-signal systems.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact, manufacturable package: 900-BBGA / 900-FBGA (31×31) surface-mount package enables dense board-level integration.
• Controlled core supply: Narrow 1.14 V–1.26 V supply range simplifies power-rail design for the FPGA core.

Why Choose XC6SLX150T-3FGG900I?

The XC6SLX150T-3FGG900I balances high logic capacity, substantial embedded memory, and a large I/O complement within a compact 900-BBGA package, making it well suited to designs that require dense, configurable logic and on-chip data storage in an industrial temperature envelope. Its combination of CLBs, logic elements, and RAM supports complex digital processing tasks while minimizing external component count.

This device is appropriate for engineering teams targeting scalable, robust FPGA implementations where board space, I/O density, and industrial temperature operation are primary concerns.

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