XC6SLX150T-3FGG900C

The XC6SLX150T-3FGG900C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD designed for commercial embedded designs. It provides a high logic capacity and substantial on-chip memory in a compact 900-BBGA surface-mount package, with a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

With a large number of logic elements and a high I/O count, this device is suited for integrating multiple digital functions and interfaces into a single FPGA for mid- to high-complexity applications.

Key Features

• Core Logic — 147,443 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O — 540 user I/O pins to accommodate multiple interfaces and parallel connections.
• Power — Core voltage supply range of 1.14 V to 1.26 V.
• Package — 900-BBGA (supplier package: 900-FBGA, 31×31) in a surface-mount form factor for high pin density.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Mounting — Surface mount package suitable for standard PCB assembly processes.
• Environmental — RoHS compliant.

Typical Applications

• Custom digital processing — Implement application-specific processors, accelerators, and control logic using the device's high logic capacity and embedded RAM.
• High-density I/O interfacing — Support multiple parallel and serial interfaces in communication, data-acquisition, or protocol-bridging designs with 540 I/Os.
• Prototyping and embedded development — Integrate complex logic and system functions in commercial-temperature prototypes and product designs.

Unique Advantages

• High logic capacity: 147,443 logic elements enable consolidation of multiple functions and more complex designs on a single device.
• Significant on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for many use cases.
• Extensive I/O availability: 540 user I/Os provide flexibility for interfacing and reduce the need for external IO expanders.
• Compact, high-pin-count package: 900-BBGA / 900-FBGA (31×31) offers dense routing in a surface-mount footprint.
• Commercial-grade operation: Rated 0 °C to 85 °C to match standard commercial product requirements.
• RoHS compliant: Meets lead-free and environmental compliance needs for modern assemblies.

Why Choose XC6SLX150T-3FGG900C?

The XC6SLX150T-3FGG900C positions itself as a high-capacity Spartan®-6 LXT FPGA option for commercial embedded systems requiring substantial logic resources, on-chip memory, and extensive I/O in a single surface-mount package. Its electrical and thermal ratings support typical commercial electronic product environments while offering a compact, high-pin-count footprint.

This device is suited to engineers and procurement teams building mid- to high-complexity systems who need verifiable on-chip resources and environmental compliance. The combination of logic density, embedded RAM, and I/O count enables designers to simplify board-level integration and reduce component count.

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