XC6SLX150T-3FGG484I

IC FPGA 296 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 147443 484-BBGA

Quantity 777 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11519Number of Logic Elements/Cells147443
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX150T-3FGG484I – Spartan®-6 LXT FPGA, 484-BBGA

The XC6SLX150T-3FGG484I is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 484-BBGA surface-mount package. It provides a large logic capacity and substantial on-chip memory, packaged and qualified for industrial temperature operation.

This device targets embedded and industrial applications that require significant programmable logic, plentiful I/O, and sustained operation across an extended temperature range, while enabling compact board-level integration.

Key Features

  • Logic Capacity  147,443 logic elements provide extensive programmable resources for implementing complex digital functions and custom logic blocks.
  • Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive processing without relying solely on external memory.
  • I/O Resources  296 user I/Os to support diverse peripheral interfaces and multiple parallel connections on a single device.
  • Power  Core operating voltage range of 1.14 V to 1.26 V for predictable supply design and power management.
  • Package and Mounting  484-BBGA (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor to minimize board footprint and support high-density PCB layouts.
  • Temperature and Grade  Industrial-grade device with an operating temperature range of −40°C to 100°C for reliable operation in demanding environments.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High on-chip integration: The combination of 147,443 logic elements and approximately 4.94 Mbits of embedded memory reduces dependency on external components and simplifies BOMs.
  • Ample interfacing capability: 296 I/Os enable multiple peripheral connections and flexible partitioning of signals across the board.
  • Industrial-ready operation: Rated for −40°C to 100°C, suitable for continuous use in temperature-challenging environments.
  • Compact BGA footprint: The 484-BBGA surface-mount package supports high-density designs where board space is at a premium.
  • Predictable power envelope: A defined core voltage window (1.14 V–1.26 V) helps streamline power-supply selection and thermal planning.
  • Vendor-backed platform: Built on AMD’s Spartan®-6 LXT family, providing a known architecture for deployment in established design flows.

Why Choose XC6SLX150T-3FGG484I?

The XC6SLX150T-3FGG484I positions itself as a robust, industrial-grade FPGA option for designs that demand a large number of logic elements, substantial embedded memory, and plentiful I/O in a compact BGA package. Its combination of capacity and temperature rating makes it suitable for embedded and industrial applications where integration density and reliability matter.

Designers and procurement teams looking for a scalable, vendor-supported Spartan®-6 LXT device will find this part well suited for complex logic implementations that benefit from on-chip memory and a high I/O count while maintaining a compact board footprint.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC6SLX150T-3FGG484I.

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