XC6SLX150T-3FGG484C

The XC6SLX150T-3FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD, provided in a 484‑ball BGA package for surface-mount assembly. It delivers a large on-chip logic and memory resource set that supports complex, programmable digital designs in commercial-grade applications.

Key on-chip resources include 147,443 logic elements and approximately 4.94 Mbits of embedded RAM, along with 296 general-purpose I/O pins and a defined core supply voltage range of 1.14 V to 1.26 V. The device is RoHS compliant and specified for 0 °C to 85 °C operation.

Key Features

• Core Logic — 147,443 logic elements for implementing substantial custom digital logic and control functions.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, tables, and state storage without external memory.
• I/O Capacity — 296 user I/O pins to accommodate multi-channel interfacing and high-signal-count designs.
• Power Supply — Core voltage specified from 1.14 V to 1.26 V to match target power-domain requirements.
• Package & Mounting — 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) with surface-mount mounting suitable for compact board integration.
• Commercial Grade & Temperature Range — Rated for commercial-grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Use the device to implement large-scale programmable logic functions where high logic element count and embedded RAM are required.
• I/O‑dense interfacing — Designs that need many external signals can leverage the 296 available I/O pins for peripheral, sensor, and bus connectivity.
• Commercial embedded systems — Commercial-grade temperature rating and RoHS compliance make the device suitable for general-purpose embedded products and equipment.

Unique Advantages

• High logic capacity: 147,443 logic elements enable complex state machines, datapaths, and parallel processing architectures on a single device.
• Substantial on-chip memory: Approximately 4.94 Mbits of RAM reduce reliance on external memory for many buffering and lookup-table needs.
• Generous I/O count: 296 I/O pins provide flexibility for multi-channel interfaces and mixed-signal front-end connectivity.
• Compact BGA footprint: The 484‑BBGA (484‑FBGA, 23×23) package offers a dense integration option for space-constrained PCBs while supporting surface-mount assembly.
• Tightly defined core supply: A 1.14 V to 1.26 V supply window simplifies power-domain design for the FPGA core.
• Commercial readiness and compliance: Commercial-grade temperature specification and RoHS compliance support mainstream product requirements.

Why Choose XC6SLX150T-3FGG484C?

The XC6SLX150T-3FGG484C combines a high count of logic elements and sizable embedded RAM with a large I/O complement in a compact BGA package, making it a practical choice for commercial-grade programmable logic projects that demand integration and flexibility. As part of the Spartan‑6 LXT family from AMD, it provides a known FPGA architecture with clear, verifiable device-level specifications.

This part is well suited to designers and teams building medium- to high-complexity digital systems that require significant on-chip resources, predictable power supply requirements, and commercial-temperature operation. Its combination of resources and package options supports scalable implementations and streamlined board-level integration.

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