XC6SLX150T-2FGG900C

The XC6SLX150T-2FGG900C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) by AMD, provided in a 900-ball BGA package. It delivers substantial programmable logic capacity, a high I/O count and several megabits of on-chip RAM for designs that require dense logic resources and significant embedded memory.

Designed for surface-mount deployment and commercial temperature operation, the device targets applications that need a balance of logic density, I/O integration and compact packaging while conforming to RoHS requirements.

Key Features

• Logic Capacity  Approximately 147,443 logic elements for implementing complex combinational and sequential logic.
• Configurable Logic Blocks  Design capacity includes 11,519 logic blocks to structure programmable resources.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for FIFOs, buffers and data storage.
• I/O Count  540 user I/O pins to support extensive interfacing and parallel connectivity.
• Package and Mounting  900-BBGA (supplier package 900-FBGA, 31×31) in a surface-mount form factor for compact board integration.
• Power  Core supply voltage range specified from 1.14 V to 1.26 V.
• Temperature Range  Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant construction.
• Manufacturer  Produced by AMD.

Typical Applications

• High-density digital systems  Suitable for designs that need large programmable logic capacity and many I/O lines for parallel data paths and complex control logic.
• Memory-intensive processing  Embedded memory capacity supports buffering, packet handling and on-chip data storage for streaming and control tasks.
• Interface aggregation  High I/O count enables aggregation and routing of multiple external interfaces in a single FPGA solution.

Unique Advantages

• Substantial on-chip logic  Approximately 147,443 logic elements allow implementation of large finite-state machines, datapaths and custom accelerators without external logic.
• Significant embedded memory  Nearly 5 Mbits of RAM reduces dependence on external memory for many buffering and temporary storage needs.
• High I/O integration  540 I/O pins simplify board-level design by accommodating numerous peripherals and parallel interfaces directly.
• Compact BGA packaging  900-ball FBGA (31×31) package enables high-density PCB layouts while keeping the device footprint manageable.
• Commercial temperature rating  Rated for 0 °C to 85 °C operation, appropriate for standard commercial applications.
• RoHS compliance  Environmentally compliant for markets and projects requiring lead-free components.

Why Choose XC6SLX150T-2FGG900C?

The XC6SLX150T-2FGG900C combines large logic capacity, multi-megabit on-chip memory and a high I/O count in a compact 900-BBGA surface-mount package. Manufactured by AMD and designed for commercial temperature operation, it provides a balanced platform for designs that require substantial programmable resources and dense external connectivity.

This FPGA is suited to engineering teams building complex digital systems that benefit from integrated memory and I/O capability, offering scalability within the Spartan®-6 LXT family while maintaining RoHS-compliant construction.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX150T-2FGG900C and to discuss how it fits your next FPGA-based design.