XC6SLX150T-2FGG676C

The XC6SLX150T-2FGG676C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD, offered in a 676-ball BGA surface-mount package. It delivers high logic capacity, substantial on-chip RAM, and a broad I/O count in a commercial-grade device intended for programmable digital designs.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory, and 396 I/O, this device is suited to commercial embedded applications that require flexible, reconfigurable logic in a compact footprint.

Key Features

• Architecture — Spartan®-6 LXT FPGA architecture in the XC6SLX150T-2FGG676C form factor from AMD, optimized for programmable digital logic.
• Logic Capacity — 147,443 logic elements to support complex combinational and sequential logic designs.
• Embedded Memory — Approximately 4.94 Mbits (4,939,776 bits) of on-chip RAM for buffering, FIFOs, and data storage close to logic.
• I/O Resources — 396 user I/O pins enabling dense system interfaces and parallel connectivity.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package — 676-FBGA supplier device package (27×27 mm) / 676-BGA package case, surface-mount mounting for compact PCB implementation.
• Operating Range & Grade — Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use programmable logic and the device’s high logic and memory capacity to implement custom control, signal processing, or protocol conversion in commercial products.
• High-Density I/O Control — Leverage 396 I/O pins for boards requiring parallel interfaces, sensor aggregation, or multi-channel I/O management.
• Custom Digital Processing — Deploy on-chip RAM and abundant logic elements for data buffering, preprocessing, and application-specific accelerators.
• Prototyping and Evaluation — Suitable for iterative hardware design work where reconfigurability and significant logic resources are required.

Unique Advantages

• High Logic Density: 147,443 logic elements provide capacity for complex designs without immediate need for higher-tier devices.
• Substantial On-Chip RAM: Approximately 4.94 Mbits of embedded memory reduces reliance on external RAM for many buffering and temporary-storage tasks.
• Extensive I/O Count: 396 I/O pins support dense interfacing options and parallel system architectures.
• Compact Surface-Mount Package: 676-FBGA (27×27 mm) package allows high-density PCB layouts while maintaining numerous pin connections.
• Controlled Core Voltage: Defined supply range (1.14–1.26 V) for predictable power integration in system designs.
• Commercial-Grade Qualification: Designed for commercial applications with an operating range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Why Choose XC6SLX150T-2FGG676C?

The XC6SLX150T-2FGG676C balances significant logic capacity, on-chip memory, and a high I/O count in a compact 676-ball BGA package, making it a practical choice for commercial embedded designs that require flexible, reconfigurable digital logic. Manufactured by AMD, this Spartan®-6 LXT device fits applications where substantial programmable resources and surface-mount packaging are priorities.

For engineers and procurement teams building commercial products, this part offers a combination of capacity, integration, and predictable operating conditions that supports medium- to high-complexity FPGA implementations while keeping board space and BOM considerations in mind.

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