XC6SLX150T-2FGG484C

The XC6SLX150T-2FGG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 484-ball BGA package. It provides a high-density, programmable hardware platform with a large logic capacity and embedded memory for implementing custom digital logic and system-level functions.

Designed for commercial-grade applications, the device combines a broad I/O count with a compact surface-mount package and a defined supply and temperature range to suit a variety of programmable-logic projects.

Key Features

• Logic Capacity  Approximately 147,443 logic elements, enabling complex digital designs and large-scale logic implementations.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for data buffering, state storage, and algorithm implementation.
• I/O  296 user I/Os to support diverse interfacing requirements and multiple peripheral connections.
• Core Voltage  Specified supply range of 1.14 V to 1.26 V to match target power-rail requirements.
• Package & Mounting  484-ball BGA package (Supplier device package listed as 484-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS-compliant construction to meet standard environmental and material guidelines.

Typical Applications

• Custom Digital Logic  Implement programmable state machines, protocol bridges, and hardware-accelerated logic tailored to specific system requirements.
• System Integration  Consolidate multiple discrete functions into a single programmable device to reduce board complexity and BOM.
• Prototyping and Development  Use the FPGA’s reprogrammable fabric and large logic/memory resources for design validation and iterative hardware development.

Unique Advantages

• High Logic Density: Roughly 147,443 logic elements provide headroom for complex designs without immediate need for higher-tier devices.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM supports buffering, lookup tables, and data-path storage inside the FPGA fabric.
• Generous I/O Count: 296 I/Os enable flexible interfacing to peripherals, sensors, and multiple high-pin-count subsystems.
• Compact Surface-Mount Package: 484-ball BGA (484-FBGA, 23×23) minimizes PCB footprint while supporting dense interconnects.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operating range for standard commercial deployments.
• Regulatory Compliance: RoHS-compliant to support environmentally conscious designs and manufacturing.

Why Choose XC6SLX150T-2FGG484C?

The XC6SLX150T-2FGG484C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 484-ball BGA footprint. Its commercial-grade specification and defined supply/temperature ranges make it suitable for designers seeking a programmable platform that supports complex digital functions while maintaining a small PCB footprint.

This FPGA is well suited for teams developing customizable hardware solutions, consolidating discrete components into programmable logic, or accelerating prototyping cycles—offering a measurable, verifiable foundation for scalable designs backed by AMD’s Spartan®-6 LXT architecture.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX150T-2FGG484C and to discuss how it fits your design requirements.