XC6SLX150T-2FGG484I

The XC6SLX150T-2FGG484I is a Spartan®-6 LXT field programmable gate array (FPGA) manufactured by AMD. It provides a high logic capacity and on-chip memory in a 484-ball BGA package for surface-mount board assemblies.

Key device attributes visible in the product data include 147,443 logic elements, approximately 4.94 Mbits of embedded memory, 296 user I/O pins, an industrial operating temperature range, and a narrow core supply voltage range—features that support dense, deterministic programmable-logic implementations.

Key Features

• Logic Capacity  147,443 logic elements for complex programmable logic and glue-logic implementations.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM suitable for buffering, small FIFOs, and local data storage.
• I/O Count  296 user I/O pins to support wide peripheral connectivity and multi-channel interfacing.
• Power Supply  Core voltage supply specified from 1.14 V to 1.26 V for deterministic power planning.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Programmable logic integration  Use where substantial logic capacity and on-chip RAM are required within a surface-mount BBGA footprint.
• High-density I/O systems  Fits designs that require hundreds of user I/O signals routed through a compact BGA package.
• Industrial temperature deployments  Suitable for applications requiring operation across −40 °C to 100 °C.

Unique Advantages

• High logic density: 147,443 logic elements enable implementation of large combinational and sequential designs without external logic.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for mid-size buffering and state storage.
• Extensive I/O: 296 user I/Os permit flexible external interfacing and parallel channel support in a single device.
• Compact BGA package: 484-ball BGA (484-FBGA, 23×23) balances I/O density with a surface-mount form factor for modern PCB layouts.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports robust deployment in temperature-challenging environments.
• Controlled core voltage: A defined 1.14 V–1.26 V supply window aids predictable power-supply design and margin planning.

Why Choose XC6SLX150T-2FGG484I?

The XC6SLX150T-2FGG484I combines a large logic element count, several megabits of embedded memory, and nearly 300 user I/Os in a compact 484-ball BGA package, making it suitable for designs that require significant on-chip resources without resorting to external programmable devices. Its industrial temperature rating and RoHS compliance support long-term deployment and regulatory expectations.

This device is a fit for teams and projects that need a high-capacity, surface-mount FPGA with defined power requirements and a high I/O complement—providing scalability and integration for complex programmable-logic applications while leveraging AMD as the manufacturer.

If you would like pricing, availability, or to request a quote for XC6SLX150T-2FGG484I, submit a request or contact sales to receive a formal quotation and support information.