XC6SLX150T-2FG484C

IC FPGA 296 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 147443 484-BBGA

Quantity 736 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11519Number of Logic Elements/Cells147443
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX150T-2FG484C – Spartan®-6 LXT Field Programmable Gate Array (FPGA) 484-BBGA

The XC6SLX150T-2FG484C is a Spartan®-6 LXT field programmable gate array (FPGA) provided in a 484-ball BGA package. It delivers a high-capacity programmable logic fabric with substantial embedded memory and a large I/O count for complex board-level designs.

Designed for commercial applications, this surface-mount FPGA supports a 1.14 V to 1.26 V core supply and operates across a 0 °C to 85 °C range, offering a balance of logic density, on-chip RAM, and I/O resources for a variety of digital designs.

Key Features

  • Logic Capacity  Approximately 147,443 logic elements for implementing large-scale programmable logic and custom digital functions.
  • Configurable Logic Blocks  11,519 CLBs providing the granular logic resources used to build combinational and sequential circuits.
  • Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and temporary data storage without external memory.
  • I/O Resources  296 user I/O pins to support multiple interfaces, parallel buses, and board-level connectivity.
  • Package and Mounting  484-BBGA (supplier package: 484-FBGA, 23×23 mm footprint) in a surface-mount form factor for compact PCB integration.
  • Power and Thermal  Core supply voltage range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C for typical electronics environments.
  • Environmental Compliance  RoHS compliant, meeting common environmental requirements for electronics assemblies.
  • Grade  Commercial grade device suitable for standard commercial and industrial-adjacent applications within the specified temperature range.

Typical Applications

  • Custom Digital Logic and Prototyping  Use the FPGA's large logic capacity and CLB count to prototype or deploy custom digital functions and algorithms on silicon.
  • High-Density I/O Interfacing  With 296 I/O pins, the device is suitable for board-level interfacing tasks, parallel data buses, and glue logic between subsystems.
  • On-Chip Data Buffering  Approximately 4.94 Mbits of embedded RAM enables on-chip buffering, packet queues, and temporary storage without immediate reliance on external memory.
  • Compact System Integration  The 484-ball BGA (23×23 mm) package and surface-mount mounting make the FPGA suitable for space-constrained PCB layouts.

Unique Advantages

  • High Logic Density:  Approximately 147,443 logic elements allow implementation of sizable custom logic and moderate system-on-chip functions.
  • Large CLB Count:  11,519 configurable logic blocks provide the building blocks for complex finite-state machines and datapaths.
  • Significant On-Chip Memory:  Around 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
  • Extensive I/O:  296 I/O pins enable rich connectivity options for sensors, peripherals, and high-pin-count interfaces.
  • Compact BGA Package:  484-BBGA (484-FBGA, 23×23) offers a small PCB footprint for high-density system designs.
  • RoHS Compliant:  Meets RoHS requirements, supporting regulatory needs for lead-free assemblies.

Why Choose XC6SLX150T-2FG484C?

The XC6SLX150T-2FG484C positions itself as a high-capacity, commercially graded FPGA option for designers needing substantial programmable logic, on-chip RAM, and a large number of I/Os in a compact surface-mount package. Its specified core voltage range and commercial temperature rating make it suitable for a wide set of conventional electronic applications.

Choose this Spartan®-6 LXT FPGA when your design requires a balance of logic density, embedded memory, and connectivity in a RoHS-compliant 484-BBGA package, enabling efficient board-level integration and reduced external component needs.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX150T-2FG484C.

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