XC6SLX150-3FG676C

The XC6SLX150-3FG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, provided in a 676-ball BGA package for surface-mount applications. It delivers a high-density combination of logic resources, on-chip memory, and I/O capability tailored for commercial electronic designs that require flexible, reconfigurable digital logic.

With its large logic element count and substantial embedded RAM, this FPGA is suited to designs that need complex custom logic, data buffering, and extensive peripheral interfacing while operating within standard commercial temperature ranges.

Key Features

• Logic Resources  Provides 11,519 CLBs and 147,443 logic elements to implement complex, custom digital functions and parallel processing architectures.
• Embedded Memory  Includes approximately 4.94 Mbits of on-chip RAM for data buffering, state storage, and local memory requirements.
• I/O Capacity  498 user I/O pins enable broad peripheral and bus interfacing without external multiplexing.
• Power  Operates from a core voltage supply range of 1.14 V to 1.26 V, supporting modern low-voltage system designs.
• Package & Mounting  676-BGA package (supplier device package: 676-FBGA, 27×27) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant to aid material-conformance requirements for commercial products.

Typical Applications

• Custom digital logic  Implement application-specific processing, state machines, and protocol handlers using the device’s large logic and CLB resources.
• Data buffering and local memory  Use the approximately 4.94 Mbits of on-chip RAM for packet buffering, FIFOs, and temporary storage to reduce external memory requirements.
• High-pin-count interface bridging  Support multiple peripherals and bus connections with 498 I/O pins for flexible system integration.
• Compact board designs  Leverage the 676-BGA package and surface-mount mounting for dense PCB layouts in commercial products.

Unique Advantages

• High core capacity: 147,443 logic elements and 11,519 CLBs enable implementation of sophisticated logic and parallel functions without splitting designs across multiple devices.
• Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces dependence on external memory for intermediate data storage and buffering.
• Extensive I/O: 498 I/O pins simplify multi-peripheral and multi-bus designs, lowering the need for additional I/O expanders.
• Commercial temperature rating: 0 °C to 85 °C supports mainstream commercial product deployments and testing profiles.
• Compact BGA package: The 676-FBGA (27×27) form factor enables space-efficient board layouts while supporting surface-mount assembly processes.
• RoHS compliant: Facilitates material compliance for commercial manufacturing and distribution.

Why Choose XC6SLX150-3FG676C?

The XC6SLX150-3FG676C combines a large programmable fabric with meaningful on-chip memory and a high I/O count in a compact 676-BGA package, making it a practical choice for commercial designs that require scalable programmable logic and dense integration. Its core voltage range and commercial temperature grade align with typical board-level power and environmental conditions for mainstream products.

This device is appropriate for engineering teams building custom digital systems, high-pin-count interface solutions, or designs that benefit from significant local RAM and logic resources. As an AMD Spartan®-6 LX device, it provides a balance of integration and capacity for evolving design requirements.

Request a quote or submit an inquiry to check availability, lead times, and pricing for the XC6SLX150-3FG676C.