XC6SLX150-3FG484C

The XC6SLX150-3FG484C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD. It provides a high density of programmable logic, on-chip memory, and a large I/O complement in a 484-BBGA package for surface-mount board designs.

With 147,443 logic elements, approximately 4.94 Mbits of embedded memory and 338 I/O pins, this commercial-grade device targets designs that require significant programmable logic capacity, local RAM resources and extensive external interfacing while operating from a 1.14 V to 1.26 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Core Density  147,443 logic elements for implementing complex digital functions and aggregation of multiple logic blocks on a single device.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage and local data processing without external memory.
• I/O Capacity  338 I/O pins to accommodate extensive external interfaces and peripheral connections.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount assembly.
• Power  Specified core voltage supply range of 1.14 V to 1.26 V for consistent power delivery and integration into regulated power domains.
• Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• RoHS Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Programmable logic and prototyping  Leverage 147,443 logic elements and embedded RAM to implement, validate and iterate complex digital designs on a single FPGA.
• Interface aggregation  Use 338 I/Os to consolidate multiple peripheral and bus interfaces, simplifying board-level connectivity.
• On-chip buffering and data handling  Approximately 4.94 Mbits of embedded memory supports local buffering and intermediate data storage for real-time processing tasks.

Unique Advantages

• High logic capacity: 147,443 logic elements enable integration of substantial digital functionality without multiple devices.
• Significant embedded memory: Approximately 4.94 Mbits of on-chip RAM reduces dependence on external memory for many buffering and stateful tasks.
• Extensive I/O: 338 I/O pins provide flexibility to connect sensors, interfaces and peripherals directly to the FPGA.
• Compact BGA footprint: 484-BBGA (484-FBGA, 23×23) package offers a high-density form factor for surface-mount applications.
• Commercial temperature range: Rated for 0 °C to 85 °C to match standard commercial deployment environments.
• Regulatory alignment: RoHS compliance supports environmentally conscious designs and manufacturing processes.

Why Choose XC6SLX150-3FG484C?

The XC6SLX150-3FG484C positions itself as a high-capacity Spartan®-6 LX FPGA that balances programmable logic density, embedded memory and a large I/O count in a compact 484-BBGA package. Its commercial grade and defined supply and temperature ranges make it suitable for board-level designs that require on-chip resources and extensive interfacing.

This device is appropriate for development teams and procurement organizations specifying an FPGA for applications that demand substantial logic and memory integration while maintaining a surface-mount BGA footprint. The combination of logic elements, on-chip RAM and I/O versatility offers scalability and integration potential throughout the product development lifecycle.

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